Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LMUN2213LT1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LMUN2213LT1G
- Type
- LRC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LMUN2213LT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Digital Transistor
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0094304995
- Operating Temperature
- 55℃~+150℃
- Resistor
- 1
- Resistor
- 47kΩ
- Transistor Type
- NPN
- Power Dissipation(Pd)
- 246mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LMUN2213LT1G 产品概述
概述
LMUN2213LT1G是一种高性能数字晶体管，由乐山无线电（LRC）制造，广泛应用于各种电子电路中。这款NPN晶体管具有预偏置特性，能够在低电压和小电流条件下稳定工作。其额定功率为246毫瓦，最大承受电压为50伏，最大集电极电流为100毫安。由于其良好的电气性能和广泛的应用范围，LMUN2213LT1G已成为许多电子设计工程师的理想选择。
产品特性
晶体管类型：LMUN2213LT1G为NPN型晶体管，适用于低功耗应用。NPN晶体管在良好的输入和输出特性条件下，能够有效放大电流，因此广泛应用于放大器、开关电路等场合。
功率规格：此晶体管的最大功耗为246毫瓦，适合于小型化电路设计。其较高的功率处理能力能够处理各种负载和驱动要求，同时确保电路稳定运行。
电流与电压：LMUN2213LT1G的额定最大集电极电流为100毫安，最大集电极-发射极电压为50伏。这使得其在处理一般的逻辑信号、开关负载时表现出色，能够满足大多数应用的需求。
预偏置特性：产品设计中包含的预偏置功能，使得LMUN2213LT1G在电源上电后能够迅速稳定工作，减少了启动时间。这一特性在快速开启的数字电路中尤为重要。
封装形式：LMUN2213LT1G采用SOT-23(SOT-23-3)封装，体积小巧，适合于高密度布线的印刷电路板（PCB）设计。SOT-23封装在现代电子设计中非常流行，易于手工焊接和自动化生产。
应用领域
LMUN2213LT1G的广泛适用性使其在多种电子设备中扮演重要角色。主要应用如下：
消费类电子产品：可用于手机、平板电脑、音响设备等消费类电子产品中的信号放大和开关功能。
工业控制：在各种工业仪器中，LMUN2213LT1G常常用于驱动小功率负载，如继电器、LED指示灯等。
汽车电子：现代汽车中的各种电子控制单元（ECU）也可能使用LMUN2213LT1G，进行信号处理和电源开关。
通信设备：在无线电和通信设备中，晶体管可用于信号放大和调制解调功能。
计算机外围设备：随时监听和操作设备状态的外围设备，如打印机、扫描仪等，也会用到LMUN2213LT1G作为电子开关或信号放大器。
总结
LMUN2213LT1G是一款高效、稳定的小型NPN数字晶体管，具备优良的电气性能和广泛的应用潜力。其246毫瓦的功率规格及50伏和100毫安的额定电压和电流，使其在众多行业如消费电子、工业控制、汽车电子等领域都能找到身影。该产品凭借其预偏置特性和SOT-23封装，进一步增强了应用的灵活性与便贴性。无论是经验丰富的工程师还是初学者，LMUN2213LT1G都是离不开的优秀选择，用于设计和开发现代电子产品的核心组件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
