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LRC L1SS400GT1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC L1SS400GT1G
- Type
- LRC
- Minimum package
- 4000
Technical parameters
- Electronic Component
- LRC
- Electronic Component
- L1SS400GT1G
- Electronic Component
- 1
- Package
- SOD-723
- Electronic Component
- Switch Diode
- Electronic Component
- 0.019g
- Electronic Component
- 1
- Electronic Component
- BM0264382391
- Current
- 100mA
- Diode
- Electronic Component
- Current(Ir)
- 100nA
- (Vf)
- 1.2V
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 4000
- Voltage Rating(Vr)
- 80V
- (Trr)
- 4ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
L1SS400GT1G 产品概述
一、产品简介
L1SS400GT1G 是乐山无线电（LRC）推出的一款小型开关二极管，单只封装（独立式），采用 SOD-723 封装形式。该器件针对高速开关与小信号整流场合优化设计，具有低反向泄漏、快速恢复和较低正向压降的特性，适合高密度装配的消费电子、通讯与信号处理电路。
二、主要参数与特性
- 正向压降 (Vf)：约 1.2V（典型值）
- 直流反向耐压 (Vr)：80V
- 最大整流电流：100mA（连续）
- 功率耗散 (Pd)：200mW
- 反向电流 (Ir)：100nA（典型，低漏电）
- 反向恢复时间 (Trr)：4ns（高速切换）
- 非重复峰值浪涌电流 (Ifsm)：500mA（瞬态耐受）
- 封装：SOD-723，单只表面贴装（SMD）
这些参数表明 L1SS400GT1G 在小电流、高频率切换和低功耗应用上具有优势，且封装尺寸小，便于高密度 PCB 布局。
三、典型应用场景
- 高速逻辑信号整形与开关阵列的钳位或隔离
- 小信号整流与去耦，例如小电流电源回路、检测电路
- 保护电路——防止反向电压或瞬态脉冲对敏感器件的损害
- 移动设备、消费电子的信号路径与接口电路
- 高频开关电路与脉冲应用（受限于功率耗散和平均电流）
四、封装与热管理
SOD-723 为超小型表面贴装封装，适合空间受限的设计，但也带来散热限制。器件 Pd 为 200mW，实际允许的连续整流电流受环境温度、PCB 铜箔面积以及焊盘散热能力影响较大。建议在布局时：
- 为二极管提供合理的散热铜箔，必要时加宽焊盘或加铜通孔到内层/底层；
- 对于连续接近额定整流电流的工作点，进行热仿真或实际测温验证并适当降额使用。
五、选型与使用建议
- 若电路对正向压降敏感（需更低 Vf），可考虑 Schottky 二极管替代；
- 需要注意的是 100mA 为最大整流电流，长期工作建议留有余量（例如在 50–70% 区间）；
- 对于存在较大瞬态浪涌的场合，Ifsm 为 500mA，可承受短时脉冲，但不要作为长期过流保护；
- 在高速开关（Trr≈4ns）的应用中，注意与寄生电感、电容带来的振铃或过冲，适当增加阻尼或 RC 抑制。
六、可靠性与注意事项
- 保持焊接工艺参数在器件规范允许范围内，避免过热导致封装或焊点应力；
- 在高温高湿环境下长期工作时，低漏电特性可能随温度上升而改变，设计时需考虑温漂；
- 设计时遵循去耦、合理走线和地线回流的规则，以发挥器件快速恢复与低漏电的优势。
总结：L1SS400GT1G 以其 80V 反向耐压、约 1.2V 的正向压降、4ns 的快速恢复和小型 SOD-723 封装，适合用于对体积、速度与漏电有要求的小功率开关与信号整流场合。在使用中注意热管理与电流降额以保证长期可靠性。
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