WMSIC Electronic Components

LRC LN2308LT1G

ModelLN2308LT1G
PackageSOT-23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LN2308LT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LN2308LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0226525942
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
700mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
350pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LN2308LT1G 产品概述

一、产品简介

LN2308LT1G 是乐山无线电(LRC)推出的一款小型 SOT-23 封装单片 N 沟道场效应管,额定漏源电压 60V,连续漏极电流 2.6A。器件适合低功耗开关与功率控制场合,工作温度范围宽(-55℃ ~ +150℃),适用于工业级与消费类电路板空间受限的应用。

二、主要参数

  • 漏源电压 Vdss:60V
  • 连续漏极电流 Id:2.6A
  • 导通电阻 RDS(on):130mΩ @ Vgs=4.5V, Id=2.1A
  • 阈值电压 Vgs(th):3V(典型)
  • 栅极电荷 Qg:12nC @ 10V
  • 输入电容 Ciss:350pF @ 30V
  • 反向传输电容 Crss:12pF @ 30V
  • 功耗 Pd:700mW
  • 封装:SOT-23
  • 数量/通道:1 个 N 沟道

三、特性与优势

  • 紧凑封装(SOT-23),适合集成密度高的 PCB 设计。
  • 60V 耐压与 2.6A 连续电流能力使其在中低功率开关、负载开关和保护电路中具有良好通用性。
  • 130mΩ 的 RDS(on)(在 4.5V 驱动下)对 3.3V/4.5V 逻辑电平设计较为友好,配合合理驱动可获得较低导通损耗。
  • 中等栅电荷(12nC)在中低频开关中能保持开关损耗与驱动功耗的良好平衡。

四、典型应用

  • 电池供电系统的低侧开关与电源管理。
  • 升降压转换器中次级/主开关或同步整流器(根据散热条件评估)。
  • 负载开关、过流保护和逆向保护电路。
  • 一般开关驱动与电平移位电路。

五、设计与使用建议

  • 为达到标称 RDS(on),建议栅极驱动电压≥4.5V;若仅用 3.3V 驱动,应验证导通电阻与温升是否满足系统要求。
  • 栅极电荷 Qg=12nC,在高开关频率下会产生明显驱动功耗。举例:以 10V 驱动、100kHz 开关频率时,栅极驱动功耗约为 12nC×10V×100kHz=12mW。
  • SOT-23 封装热阻较高,额定 2.6A 通常基于理想散热条件,实际电流能力受 PCB 铜箔面积和散热设计限制;如需持续较大电流,应增加铜箔散热或并联器件。
  • Ciss/Crss 值提示在快速开关时需注意米勒效应,必要时在栅极串入合适的阻尼电阻或使用 RC 抑制以控制振铃与 EMI。

六、注意事项与可靠性

  • 请以完整器件规格书为准,关注最大 Vgs、脉冲电流、热阻等绝对最大额定值。
  • 在高温或高导通损耗工况下,监控结温以避免热失效;合理布局底层铜箔并尽量缩短电流回路以降低寄生阻抗。
  • 在开关应用中,注意减小开启/关断过渡时间对系统 EMI 的影响,并遵循制造商推荐的 PCB 布局与焊接工艺。

总结:LN2308LT1G 在 SOT-23 小封装中提供了 60V 耐压与适中的导通性能,适合对体积和成本敏感的低至中功率开关场合。设计时重点在于合理的栅极驱动、散热与 PCB 布局,以发挥器件的最佳性能。若需更详细的电气特性曲线与封装尺寸,请参考厂家完整数据手册。

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