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LRC EFM108
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC EFM108
- Type
- LRC
- Minimum package
- 7500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- EFM108
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.105g
- Electronic Component
- 1
- Electronic Component
- BM0265750678
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA
- (Vf)
- 1.7V
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 7500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EFM108 产品概述
一、产品简介
EFM108 为 LRC（乐山无线电）出品的一款通用独立二极管，采用 SMA 小型表面贴装封装。该器件侧重于高压耐受与可靠整流能力，适用于对反向耐压和整流电流有明确要求的电源与高压电路场合。
二、主要电气参数
- 结构形式：独立二极管（单只）
- 正向压降（Vf）：约 1.7V（具体以厂家数据手册测试条件为准）
- 直流反向耐压（Vr）：600V（最大反向阻断电压）
- 反向电流（Ir）：典型 5µA（在额定 Vr 条件下，随温度升高会增加）
- 整流电流（Io）：1A（平均整流电流，受封装散热能力限制）
三、封装与热管理
EFM108 使用 SMA 封装，适合中等功率的表面贴装应用。SMA 封装体积小、焊接可靠，但热阻相对较高；在接近额定工作电流时应采用较宽的 PCB 铜箔、必要时增加散热铜箔或过孔，以保证结温控制在安全范围内并延长寿命。
四、典型应用场景
- 高压整流电路：整流输出或高压二极管模块
- 开关电源（SMPS）高压侧整流或保护
- 反向电压保护、电池防逆连接
- 电压倍增器、医疗或工业高压模块（需按应用规范选型）
- 飞返/钳位回路、浪涌抑制配合阻容网络使用
五、设计与布板建议
- 正向电流接近 1A 时，保证 PCB 铜箔面积充足并采用热引线或散热过孔，避免局部过热。
- 考虑到反向漏电随温度显著上升，关键高阻隔场合应留有边际裕量并做温度评估。
- 若电路存在高幅值脉冲浪涌，推荐在器件前端配置限流元件或吸收网络以保护二极管。
- 焊接工艺按 SMA 标准进行，回流曲线遵循厂商建议，避免过热导致封装应力或性能退化。
六、可靠性与注意事项
- 反向耐压为 600V，但长期工作建议按安全裕量选型，避免长期在额定极限附近运行。
- 反向电流在高温下会增加，环境温度与结温控制对漏电与寿命影响显著。
- 储存与搬运避免潮湿和机械冲击，焊接后应进行必要的清洁以防污染影响可靠性。
七、选型提示
EFM108 适合需要中等整流电流与高反向耐压的通用场景。若需要更低正向压降或更高峰值浪涌能力，可考虑规格更高或采用金属封装的替代型号；若对漏电严格敏感，可选低漏型或冷态漏电更小的专用器件。
总结：EFM108 在 600V 高压耐受与 1A 整流能力之间提供了平衡，SMA 封装便于贴装与批量生产，是工业电源与高压整流等场合的常用通用选择。
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