Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LR6230B33F
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LR6230B33F
- Type
- LRC
- Minimum package
- 12000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 150mV@(150mA)
- Electronic Component
- LRC
- Electronic Component
- LR6230B33F
- Electronic Component
- 1
- Package
- DFN-4(1x1)
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.018g
- Electronic Component
- 1
- Electronic Component
- BM0228587518
- Operating Temperature
- 40℃~+85℃@(Ta)
- Operating Voltage
- 7V
- Output
- Electronic Component
- Output Voltage
- 3.3V
- Output Current
- 300mA
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LR6230B33F 线性稳压器产品概述
一、产品简介
LR6230B33F 是乐山无线电（LRC）推出的一款低压差、超低静态电流固定输出 LDO 稳压器，输出电压 3.3V，输出电流最高可达 300mA。器件采用 DFN-4 (1×1 mm) 小封装，针对低功耗、便携与电池供电系统做了优化，具备过流保护与短路保护，适合对待机功耗和输出净度有较高要求的应用场景。
二、主要性能参数
- 输出类型：固定输出（3.3V）
- 最大工作电压：7V
- 最大输出电流：300mA
- 压差（Dropout）：150mV @ 150mA（典型）
- 电源纹波抑制比（PSRR）：65dB @ 1kHz
- 静态电流（Iq）：典型 5μA，适合低功耗待机
- 保护功能：过流保护、短路保护
- 工作温度范围：-40℃ ~ +85℃（Ta）
- 输出极性：正极；通道数：1
- 封装：DFN-4 (1×1 mm)
- 品牌：LRC（乐山无线电）
三、应用场景
- 电池供电便携设备（传感器、可穿戴设备、遥控器）
- 低功耗物联网节点、无线模块和MCU电源
- 模拟前端或射频电路的本地稳压（需关注功耗与散热）
- 工业控制与消费电子小型模块
四、设计与布局建议
- 输入端应靠近器件放置一个稳定的去耦电容（建议 1µF～10µF 低 ESR 陶瓷），输出端也需放置合适容量的陶瓷电容以保证稳定性。
- 由于 DFN-4(1×1) 封装体积小，功耗较大时会产生明显温升。建议在 PCB 上提供较大接地铜箔或散热过孔，并尽量减少 Vin 与 Vout 的压差以降低功耗。
- 布局时 VIN、VOUT 与 GND 的电容引脚应靠近 LDO 引脚放置，减小寄生感抗，提升 PSRR 与瞬态响应。
五、注意事项
- 在设计中若可能出现高输入电压或持续大电流输出，应进行热仿真并确认器件工作点不会进入热限制区域。
- PSRR 在 1kHz 时约 65dB，能有效抑制电源纹波，但高频或极低频下的抑制能力会下降，必要时可配合滤波网络使用。
- 器件内置保护电路能提高系统可靠性，但不能替代合理的外部保护设计（如熔断/保险、电流限制等）。
LR6230B33F 以其超低静态电流、良好的 PSRR 与紧凑封装，适合对待机功耗、尺寸和输出洁净度有较高要求的便携与物联网产品。选择与布局时重视散热与电容配置，可获得稳定可靠的电源输出。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
