Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LMBTA56LT1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LMBTA56LT1G
- Type
- LRC
- Minimum package
- 3000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LMBTA56LT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0229934731
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- PNP
- Frequency(f T)
- 50MHz
- Power Dissipation(Pd)
- 225mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LMBTA56LT1G — 225mW、80V、500mA PNP 三极管产品概述
一、产品简介
LMBTA56LT1G 是乐山无线电（LRC）推出的一款小功耗 PNP 双极结晶体管，采用 SOT-23 表面贴装封装。器件在集电极电流最高 500mA、集射极击穿电压（Vceo）80V 的条件下工作，适用于中低功耗开关与信号放大场合。器件设计兼顾开关速度与线性放大特性，便于在紧凑 PCB 布局中使用。
二、主要电气参数（典型/数据给定）
- 极性：PNP
- 集电极电流 Ic：最大 500mA
- 集射极击穿电压 Vceo：80V
- 耗散功率 Pd：225mW（封装与环境条件相关）
- 直流电流增益 hFE：约 100（测试条件 100mA, VCE=1V）
- 特征频率 fT：50MHz（适中频率放大与开关应用）
- 集电极截止电流 Icbo：约 100nA（低漏电）
- 集射极饱和电压 VCE(sat)：约 250mV（低饱和压，适合开关）
- 工作温度范围：-55°C ~ +150°C
- 射基极击穿电压 Vebo：4V（注意基-射反向耐压）
三、封装与热特性
LMBTA56LT1G 采用 SOT-23 小封装，适合自动贴片生产与空间受限设计。封装限制了可耗散的功率（225mW），因此在设计 PCB 时建议增大铜箔散热面积或采用散热通孔以保持结温在安全范围内。短时脉冲下可承受较高电流，但需遵守器件的安全工作区（SOA）。
四、应用场景
- 高侧小功率开关：PNP 极性便于与电源正极直接连接，适合做高侧驱动或电源切换。
- 线性放大：在要求中等电流和中等频率的模拟放大电路中表现良好。
- 驱动小型继电器、指示灯或低电流继电器及继电器驱动级。
- 与小信号 NPN 配合，可构成推挽输出或互补放大级。
五、使用注意事项与建议
- 基极-射极反向击穿 Vebo 仅 4V，禁止在电路中对 BE 施加过高反向电压，避免损伤。
- 在靠近最大 Ic 的工作点时注意功耗和结温，必要时采用并联或更大功率器件。
- 参考数据表中的温度系数与极限参数进行裕量设计，避免在高温下长期接近极限值。
- 若用于高频应用，请根据 fT=50MHz 评估增益裕量及负反馈设计，避免寄生振荡。
六、选型与替换建议
选择本型号时优先考虑对体积和正电源高侧控制的需求；若需更大功率或更高耗散能力，建议选用封装更大的器件；如需更高频率或更高电流增益，可比较同系列或其他厂商的规格以确认匹配。
LMBTA56LT1G 在小封装、较高耐压与中等电流能力之间提供了良好平衡，适合空间受限且需 80V 级别耐压的中低功耗应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
