WMSIC Electronic Components

LRC LRB501V-40T1G LRB501V

ModelLRB501V-40T1G
PackageSOD-323
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LRB501V-40T1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LRB501V-40T1G
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0226545625
Current
100mA
Diode
1
Current(Ir)
30uA@10V
(Vf)
550mV
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LRB501V-40T1G 产品概述

一、概述

LRB501V-40T1G 是乐山无线电(LRC)推出的一款小型肖特基整流二极管,采用 SOD-323 封装,专为空间受限且需低正向压降的低功率应用设计。器件具有低压降、快速恢复和较低的反向漏电特性,适合便携式设备、电源管理及保护电路中的整流与防反接应用。

二、主要电气参数

  • 正向压降 (Vf):典型 0.55 V(具体测试条件请参考数据手册)
  • 直流反向耐压 (Vr):40 V
  • 反向电流 (Ir):最大 30 µA @ 10 V
  • 非重复峰值浪涌电流 (Ifsm):1 A(单次脉冲峰值)
  • 额定整流电流:100 mA(连续)
  • 封装:SOD-323(小型表面贴装)

三、产品特点

  • 低正向压降:减小导通损耗,提高电源效率,适合低压差供电路径。
  • 小型封装:SOD-323 占板面积小,适合高密度 PCB 布局与便携设备。
  • 良好的浪涌承受能力:支持瞬态脉冲,增强系统可靠性。
  • 低反向漏电:在低电压电源与待机电路中能有效降低静态功耗。

四、典型应用

  • 移动设备和可穿戴终端的电源路径整流与防反接保护
  • USB/充电器输入防反接、功率路径切换
  • 低压降整流、二次侧整流与续流保护
  • 混合信号电路中的低损耗隔离与保护元件

五、封装与焊接建议

SOD-323 为小尺寸表贴封装,推荐采用标准回流焊工艺(遵循 JEDEC 回流曲线,峰值温度以元件数据手册建议为准)。焊盘布局应保证良好热扩散与机械支撑,走线尽量短以降低寄生电感。存放与贴装过程中注意防潮和静电防护。

六、可靠性与选型注意

在实际设计中应根据工作电流和功耗计算结温,避免在接近额定极限长期工作;对浪涌要求较高的场合建议配合合适的保护元件使用。选型时以官方数据手册为准,必要时进行电路级验证。

如需完整数据手册、PCB 封装图及样片或批量采购信息,可联系 LRC 供应渠道或本公司业务代表获取。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.