WMSIC Electronic Components

LRC S-LM3Z16VT1G

ModelS-LM3Z16VT1G
PackageSOD-323
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-LM3Z16VT1G
Type
LRC
Minimum package
3000

Technical parameters

Electronic Component
LRC
Electronic Component
S-LM3Z16VT1G
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzk)
400Ω
(Zzt)
40Ω
Electronic Component
BM0229954789
Diode
1
Current(Ir)
50nA
Power Dissipation(Pd)
200mW
Electronic Component
15.3V~17.1V
Electronic Component
65℃~+150℃
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S-LM3Z16VT1G 产品概述

一、产品概述

S-LM3Z16VT1G 是乐山无线电(LRC)出品的独立式稳压二极管,标称稳压值为 16.2V(允许范围 15.3V~17.1V),采用 SOD-323 小型封装,适用于对空间与成本敏感的低功耗稳压与基准场合。该器件在反向偏置时提供稳定的电压基准,反向泄漏电流极小(Ir = 50nA @ 11.2V),适合微弱电流环境下仍需稳定电压的应用。

二、主要参数与性能

  • 标称稳压值(Vz):16.2V,允差范围 15.3V~17.1V
  • 反向电流(Ir):50nA(测试点 11.2V)
  • 最大耗散功率(Pd):200mW(SOD-323 封装,注意散热限制)
  • 动态阻抗:Zzt ≈ 40Ω,Zzk ≈ 400Ω(分别代表工作区与拐点区的阻抗特性)
  • 工作结温范围:-65℃ ~ +150℃
  • 封装:SOD-323(表面贴装,体积小)
  • 品牌:LRC(乐山无线电)

三、典型应用场景

  • 作为参考电压源或偏置电路,用于小电流模拟电路、传感器前端与信号调理模块;
  • 作为电压钳位元件,用于抑制开机浪涌或保护敏感输入;
  • 通信设备、工业控制与测试测量仪器中对中高电压低功耗稳压需求的电路。

四、设计与选型要点

  1. 功率限值:SOD-323 封装的 Pd 为 200mW,应用中应考虑封装热阻与 PCB 散热,必要时减小稳流电流或采用铜箔散热区以避免结温超过限制。
  2. 动态阻抗:Zzt≈40Ω 表明在推荐工作电流下稳压能力较好,但输出阻抗仍偏高,不适合作为大电流精密参考源。
  3. 反向泄露:Ir 很小,适合低电流回路线,但在高温下泄漏会上升,应依据最大工作温度评估。
  4. 稳压容差:15.3~17.1V 的范围提示在精密应用需考虑配合调整或用电阻分压进行微调。

五、实用电路建议

  • 常见用法为串联限流电阻 R 与稳压二极管并联负载:R = (Vin − Vz) / Iz,其中 Iz 为期望的二极管稳流电流(加上负载电流)。设计时确保在最坏工况下 (高温、最大 Vin) Pd 不超过 200mW。
  • 在需要更稳定输出或更低阻抗时,可考虑并联多只或改用更大功耗封装的稳压器件。

六、封装与可靠性提示

  • SOD-323 封装适合自动贴装生产,焊接时请遵循厂家推荐的回流温度曲线与防潮存储要求;
  • 高温环境会影响泄漏电流与功率能力,长期使用建议按阻抗与功率热降额策略(derating)设计;
  • 出货前应关注批次一致性与必要的来料检验(正向、反向特性抽样测试)。

七、采购与型号说明

型号:S-LM3Z16VT1G,品牌 LRC,封装 SOD-323。选型时请核对批号、标称稳压值与热参数,并参考完整规格书以获得详细的电气特性表、测试条件与安装建议。若用于关键或高可靠性系统,建议与供应商确认环境应力测试与长期工作表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.