WMSIC Electronic Components

LRC L2SC3356WT1G

ModelL2SC3356WT1G
PackageSC-70(SC-70-3)
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC L2SC3356WT1G
Type
LRC
Minimum package
3000

Technical parameters

Electronic Component
LRC
Electronic Component
L2SC3356WT1G
Electronic Component
1
Package
SC-70(SC-70-3)
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0230658848
Operating Temperature
65℃~+150℃
Transistor Type
NPN
Frequency(f T)
7GHz
Power Dissipation(Pd)
150mW
Electronic Component
3000
Collector Current(Ic)
100mA
Current (h FE)
82

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

L2SC3356WT1G 产品概述

一、概述

L2SC3356WT1G 是乐山无线电(LRC)推出的一款小功率高频 NPN 三极管,采用 SC-70-3(SC-70)小封装,适用于空间受限的高频小信号放大与开关场合。器件在低电流条件下具有良好的直流电流增益和较高的特征频率,适合便携设备及射频前端的应用。

二、主要特性

  • 晶体管类型:NPN
  • 直流电流增益 hFE = 82(Ic=10mA, Vce=3V)
  • 特征频率 fT ≈ 7GHz,具备高频响应能力
  • 集电极电流 Ic 最大值:100mA
  • 集电极—发射极击穿电压 Vceo = 12V
  • 集电极截止电流 Icbo = 1μA,漏电流低
  • 发射极—基极反向击穿电压 Vebo = 3V
  • 最大耗散功率 Pd = 150mW(在规定环境与焊盘条件下)
  • 工作温度范围:-65℃ ~ +150℃
  • 封装:SC-70-3,适合表面贴装工艺

三、典型应用场景

  • 高频/射频小信号放大(VHF/UHF 简易级放大电路)
  • 高速开关与缓冲电路
  • 移动与便携通信终端的前端驱动
  • 小型传感器信号放大与接口驱动

四、电气与热力注意事项

  • 工作电压与电流应限制在 Vce < 12V、Ic ≤ 100mA,并考虑安全裕量以防击穿或过流。
  • 基极-发射极反向电压不可超过 3V,以免损坏结结构。
  • 最大耗散 150mW 在 SC-70 小封装下对 PCB 散热依赖较大,建议增加铜箔面积并避免长时间高功耗工作。
  • 高频使用时注意寄生电容与布局走线,短而粗的射频走线及良好接地有助于发挥 fT 优势。

五、典型电路建议与封装处理

  • 常见配置:共射放大、射极跟随器与低侧开关。若用于放大器,可在 Ic≈1~10mA 区间取得稳定 hFE 与低噪声性能。
  • 焊接与回流:遵循标准表面贴装回流工艺,避免超温或长期高温暴露以保护封装可靠性。
  • 存储与使用:在潮湿或极端环境下注意防潮防静电处理,工作温度支持宽温区但仍需避免迅速温度循环造成热应力。

六、订购信息

  • 品牌:LRC(乐山无线电)
  • 型号:L2SC3356WT1G
  • 封装:SC-70-3(SC-70)
  • 适用于需要在小型化、低功耗及中高频场合保持稳定放大或开关性能的项目。购买时请参考器件完整数据手册以获取引脚排列、详细极限值和典型参数曲线。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.