WMSIC Electronic Components

LRC S-LM5Z5V1T1G

ModelS-LM5Z5V1T1G
PackageSOD-523
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-LM5Z5V1T1G
Type
LRC
Minimum package
5000

Technical parameters

Electronic Component
LRC
Electronic Component
S-LM5Z5V1T1G
Electronic Component
1
Package
SOD-523
Electronic Component
Zener Diode
Electronic Component
0.023g
Electronic Component
1
(Zzk)
500Ω
(Zzt)
60Ω
Electronic Component
BM0264340435
Diode
1
Current(Ir)
2uA
Power Dissipation(Pd)
200mW
Electronic Component
4.8V~5.4V
Electronic Component
65℃~+150℃
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S-LM5Z5V1T1G稳压二极管产品概述

S-LM5Z5V1T1G是乐山无线电(LRC)推出的独立式小功率稳压二极管,针对低功耗、小型化电子设备的稳压/基准需求设计,凭借宽温范围、低漏电流、高精度稳压等特性,成为便携电子、IoT传感器等场景的优选器件。

一、产品核心定位与关键特性

该器件属于LRC稳压管系列中的基础型产品,核心定位为低功耗、宽温适配的小型稳压组件,关键特性包括:

  1. 标称稳压值5.1V,覆盖4.8V~5.4V实用范围,满足多数低电压电路的稳压需求;
  2. 反向漏电流仅2μA(@2V反向电压),静态功耗极低,适配电池供电的便携设备;
  3. 工作结温范围达-65℃~+150℃,可在极端环境(如户外传感器、工业低温场景)稳定工作;
  4. 采用SOD-523超小型封装,尺寸紧凑,支持高密度PCB布局;
  5. 动态阻抗低(Zzt=60Ω),稳压性能稳定,抗负载波动能力较强。

二、关键电气参数深度解析

该器件的电气参数直接决定应用场景,核心参数设计针对性明确:

(1)稳压性能参数

  • 标称稳压值(Vz):5.1V,符合常规低电压电路的基准/稳压需求(如MCU、传感器的参考电压);
  • 稳压范围(Vz范围):4.8V~5.4V,考虑了器件一致性与温度变化的影响,满足批量应用的一致性要求;
  • 动态阻抗(Zzt):60Ω(测试条件通常为1mA测试电流),表示稳压管工作点附近的电压-电流变化比,低阻抗意味着负载波动时输出电压变化小,稳压更稳定;
  • 击穿区阻抗(Zzk):500Ω(测试条件通常为击穿电流下),反映反向击穿状态下的阻抗特性,确保过压时的电流限制能力。

(2)功耗与漏电流参数

  • 耗散功率(Pd):200mW,属于小功率稳压管范畴,适用于电流需求不高的电路(如基准电压、小信号稳压),不适合大功率负载;
  • 反向漏电流(Ir):2μA(@2V反向电压),远低于常规稳压管水平,显著降低静态功耗,尤其适合电池供电的低功耗设备(如智能手环、蓝牙耳机)。

(3)温度与可靠性参数

  • 工作结温范围:-65℃~+150℃,覆盖工业级温度要求,可在低温(北方户外)、高温(车载电子)场景稳定工作;
  • 存储温度:匹配结温范围,提升器件长期可靠性。

三、封装与工艺设计

该器件采用SOD-523封装(0402尺寸,约1.0mm×0.6mm×0.5mm),优势显著:

  1. 小型化:体积仅为常规封装的1/3,支持PCB高密度布局,适配便携设备紧凑设计;
  2. 表面贴装:兼容自动化贴装工艺,生产效率高,降低制造成本;
  3. 可靠性:环氧树脂封装抗机械冲击、耐潮湿,符合工业级可靠性要求。

四、典型应用场景

结合参数特性,该器件典型应用集中在低功耗、小型化、宽温环境的电子设备中:

(1)便携电子稳压

智能手表、蓝牙耳机等电池设备,作为辅助稳压组件,稳定电池输出(如3.7V升压后稳压至5.1V,给USB接口供电)。

(2)MCU基准电压源

为MCU、FPGA提供5.1V参考电压,确保AD转换、时钟电路精度(低漏电流降低MCU电源消耗)。

(3)IoT传感器节点

户外温度/湿度传感器节点,宽温特性适应-40℃~+85℃温差,低功耗延长电池寿命。

(4)小型模块过压保护

与限流电阻配合,电源浪涌时反向击穿导通,限制后端电路电压,保护敏感器件(传感器、MCU)。

五、品牌与品质保障

该器件由乐山无线电(LRC)生产,LRC为国内知名半导体厂商,产品符合:

  1. 环保标准:RoHS、REACH指令,无铅封装;
  2. 可靠性测试:高低温循环、湿热、机械冲击测试,满足工业级要求;
  3. 一致性:批量稳压值偏差控制在±5%(4.8V~5.4V),适配大规模生产。

六、选型注意事项

  1. 功率匹配:Pd=200mW,最大工作电流Izm≈39mA(需留安全裕量),不适合负载电流超30mA场景;
  2. 温度适配:宽温范围适合极端环境,但需控制PCB温度(避免结温超150℃);
  3. 封装兼容:SOD-523需匹配0402焊盘,贴装注意精度。

综上,S-LM5Z5V1T1G是一款低功耗、宽温、小型化的稳压二极管,精准匹配便携电子、IoT、工业传感器等场景的稳压/基准需求,是高性价比选型方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.