WMSIC Electronic Components

LRC LMBR160ET1G

ModelLMBR160ET1G
PackageSOD-323HE
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LMBR160ET1G
Type
LRC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LMBR160ET1G
Electronic Component
1
Package
SOD-323HE
Electronic Component
Schottky Diode
Electronic Component
0.027g
Electronic Component
1
Electronic Component
BM0228680474
Current
1A
Diode
1
Current(Ir)
30uA
(Vf)
550mV@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMBR160ET1G 产品概述

一、概述

LMBR160ET1G 是乐山无线电(LRC)出品的一款小型肖特基整流二极管,采用 SOD-323HE 封装,专为空间受限、效率要求高的低功率整流与保护场合设计。肖特基结构带来较低的正向压降和极短的恢复时间,适合高频整流、瞬态保护与电源回路中的续流及反向隔离应用。

二、主要电气参数

  • 品牌:LRC(乐山无线电)
  • 型号:LMBR160ET1G
  • 封装:SOD-323HE(微小型表贴)
  • 正向压降 Vf:0.55 V @ 1.0 A
  • 连续整流电流 If:1 A
  • 直流反向耐压 Vr(最大):60 V
  • 反向电流 Ir:30 μA(典型,常温)
  • 非重复峰值浪涌电流 Ifsm:22 A(短时脉冲)
  • 工作结温范围:-55 ℃ 至 +150 ℃
  • 器件类型:肖特基二极管(低 Vf、快速响应)

注:以上参数为器件典型或最大额定值,具体测试条件请参照器件数据手册以获得更精确的基准。

三、主要特性与优势

  • 低正向压降:在 1 A 工作电流下 Vf 约为 0.55 V,可减少整流损耗,提高能效,延长电池供电设备的续航。
  • 低反向恢复:肖特基结构无显著反向恢复电荷,适合高频开关电源与快速脉冲场合。
  • 小体积封装:SOD-323HE 体积小,便于在高密度 PCB 设计中节省空间。
  • 耐浪涌能力:22 A 的短时浪涌能力能够承受启动或瞬态冲击电流(需按数据手册中指定的脉冲条件评估)。
  • 宽工作温度:-55 ℃ 至 +150 ℃ 的结温范围适合严苛环境与工业级应用。

四、典型应用场景

  • 开关电源输入/输出整流(高频整流场合)
  • 反向极性保护与电源 ORing 电路
  • DC-DC 转换器(降压/升压电路)中的续流二极管
  • 节能照明、便携设备、移动电源等对功耗敏感的系统
  • 快速脉冲或瞬态保护电路(配合限流措施)

五、热管理与布局建议

  • 功耗示例:在 1 A 连续正向电流下,器件耗散约 P = Vf × If ≈ 0.55 W。由于 SOD-323HE 封装散热能力有限,连续高电流工作时需重视 PCB 散热设计。
  • PCB 布局建议:
    • 在二极管下方或引脚周围增加铜箔面积(散热墩)以降低结温上升。
    • 优化热回路(通过孔/多层铜铺铜)以增强热传导至散热层。
    • 保持输入/输出走线短且宽,降低寄生电阻和电感。
  • 高温环境下使用时请评估结-壳和结-环境热阻,保证结温不超过额定上限。

六、封装与焊接注意事项

  • SOD-323HE 为微小表面贴装封装,适合自动贴装与回流焊工艺。
  • 建议采用符合 JEDEC / IPC 推荐的回流焊温度曲线,避免过长高温暴露以防封装或焊盘损伤。
  • 焊盘设计参照厂家推荐的 PCB 封装尺寸,以确保焊点可靠性与散热性能。
  • 对潮湿敏感度(MSL)等级请参见完整数据手册并按相应烘烤与储存规范处理。

七、可靠性与测试关注点

  • 在系统设计中应考虑反向漏电随温度升高显著增加的特性,尤其在高温或高压工作点时评估漏电影响。
  • 浪涌能力(Ifsm)通常基于特定脉冲宽度与波形(例如 8.3 ms 单相半波);若系统存在不同脉冲条件,应进行实际验证。
  • 建议在样机验证阶段对长期热循环、潮湿与冲击等可靠性环境进行测试。

八、典型电路示例(文字描述)

  • 电源反向保护:将 LMBR160ET1G 串联在电源正极线上,当外部接反时二极管阻断反向电流,保护后端电路;由于 Vf 低,正向工作时压降和功耗都较小。
  • ORing 电路:在电池与外部电源并联时,使用肖特基二极管实现低压降的电源自动切换,减少能量损失。

九、选型与采购建议

  • 若系统要求更高电流或更高耐压,应对比大封装或更高额定 If / Vr 的型号。
  • 在批量采购前建议索取并核对 LRC 官方数据手册与包装信息,进行样机验证以确保在目标工况下性能满足需求。
  • 对于对漏电或反向恢复有严格要求的应用,建议同时考察器件在不同温度和频率下的特性曲线。

如需获取 LMBR160ET1G 的完整电气性能曲线、封装图和 PCB 推荐尺寸,可提供进一步索取数据手册的渠道或直接查看 LRC 官方资料。

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