Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LRB521BS-40T5G LRB521BS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LRB521BS-40T5G
- Type
- LRC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LRB521BS-40T5G
- Electronic Component
- 1
- Package
- SOD-882
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Electronic Component
- BM0264601775
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 10uA
- (Vf)
- 350mV
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LRB521BS-40T5G 产品概述
一、产品简介
LRB521BS-40T5G 是乐山无线电（LRC）推出的一款独立式肖特基势垒二极管，采用 SOD-882 小型表贴封装。器件具有低正向压降、低反向泄漏和较好的浪涌能量承受能力，适用于对效率和空间密度有较高要求的便携式与消费电子产品中做整流、保护与开关用途。
二、主要参数
- 二极管类型：肖特基（独立式，单只）
- 正向压降（Vf）：典型 350 mV（按标准测试条件）
- 直流反向耐压（Vr）：40 V
- 额定整流电流：200 mA（连续）
- 反向电流（Ir）：10 μA（典型/测试条件下）
- 非重复峰值冲击电流（Ifsm）：500 mA（单次浪涌）
- 封装：SOD-882（小型表贴）
三、典型应用场景
- 低压整流与二次侧快速整流（如USB、充电器小电流线路）
- 电源管理中的反向极性保护、导通选择
- 高频开关电源与整流桥的效率优化（尤其在低压差场合）
- 信号钳位、保护电路与低功耗负载供电路径
四、设计与选型建议
- 正向压降低可减少功率损耗，但 Vf 与电流有关，选择时应参考在目标工作电流下的 Vf 曲线。
- 连续整流电流 200 mA，若电路存在较长时间或高频脉冲电流，应按平均化后的热耗散做热设计与降额处理。
- 反向泄漏 10 μA 在高温或高反压下会增加，若用于高温环境或精密测量回路需注意漏电影响。
- 非重复峰值 500 mA 适合短时浪涌缓冲，但不替代专用浪涌抑制元件；如需频繁大浪涌，选型时应考虑更高 Ifsm 器件或并联/其它保护方案。
五、封装与 PCB 布局注意
- SOD-882 为超小型封装，适合高密度贴装。布板时应尽量缩短输入/输出走线，减小寄生电感与阻抗。
- 为提高散热与焊接可靠性，建议在器件焊盘周围留足焊盘铜箔并合理安排热回流路径。
- 焊接时遵循厂家推荐的回流温度曲线，避免过热导致封装应力或性能退化。
六、可靠性、储存与使用
- 器件为静电敏感元件（ESD），装配与测试过程中请采取防静电措施。
- 建议遵循常规 SMD 元件的湿敏等级与回流焊接前的烘干/储存规范，避免潮湿导致焊接缺陷。
- 在关键应用中，可结合温度特性、长期漏电测试与加速老化评估器件寿命与稳定性。
总结：LRB521BS-40T5G 以其低 Vf、40 V 耐压与小型封装，适合用于空间受限且对效率有要求的低电流整流与保护场合。选用时应关注实际工作电流、热管理及反向泄漏对系统的影响，以确保长期可靠运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
