WMSIC Electronic Components

LRC SBR5100

ModelSBR5100
PackageTO-277A
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC SBR5100
Type
LRC
Minimum package
5000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
SBR5100
Electronic Component
1
Package
TO-277A
Electronic Component
Schottky Diode
Electronic Component
0.18g
Electronic Component
1
Electronic Component
BM0230658837
Current
5A
Diode
1
Current(Ir)
15uA@100V
(Vf)
870mV@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SBR5100 产品概述

一、产品简介

SBR5100 为 LRC(乐山无线电)出品的肖特基整流二极管,封装为 TO-277A,适合中大功率整流与开关电源应用。器件在 5A 工作电流下具有较低的正向压降(Vf = 870mV @ 5A),同时提供 100V 的直流反向耐压(Vr),并具备良好的浪涌承受能力(非重复峰值浪涌电流 Ifsm = 150A),适用于对效率与耐受能力有一定要求的电源设计。

二、主要电气与环境参数

  • 正向压降:870 mV @ 5 A
  • 直流反向耐压:100 V
  • 额定整流电流:5 A(连续)
  • 反向漏电流:15 μA @ 100 V
  • 非重复峰值浪涌电流:150 A
  • 工作结温范围:-55 ℃ ~ +150 ℃
    这些参数表明 SBR5100 在中等电压等级下能提供低导通损耗与良好的瞬态耐受能力,适合用于整流、续流与保护电路。

三、产品特点与优势

  • 低正向压降:在 5A 工作点具有较低的 Vf,可减少导通损耗,提高系统效率,尤其在连续整流与降压回路中明显节能。
  • 低反向漏电:15 μA @100V 的反向漏电在常温下较小,有利于降低待机功耗和保持高阻态下的可靠性。
  • 强浪涌能力:Ifsm 150A 可承受开机和容性负载等瞬态冲击,但仍建议按厂商规范并结合电路保护进行设计。
  • 宽温度范围:-55~+150 ℃ 的结温范围使其能适应工业级应用环境。
  • 封装利于散热:TO-277A 封装便于与散热体或机箱进行热连接,利于连续高电流工作时的温升控制。

四、典型应用场景

  • 开关电源整流(输入整流、输出续流)
  • DC-DC 转换器的二极管整流环节
  • 电池充放电路径与逆极保护
  • 太阳能、逆变器与电机驱动系统中的续流与保护
  • 工业电源与电源模块中的高效率整流

五、设计注意事项

  • 散热设计:由于 Vf 与流经电流产生的功耗,须合理计算结-壳-环境温升并采用散热片或机箱散热,必要时降低额定电流或增加并联元件。
  • 漏电随温度上升:反向漏电随结温增加显著上升,高温工况下需评估漏电带来的影响。
  • 浪涌保护:Ifsm 表示非重复峰值能力,实际使用中应结合电路浪涌波形(如半正弦或方波)与热冲击特性进行评估,并可并联抑制元件或熔断保护。
  • 与同步整流对比:肖特基优点在于无明显反向恢复、低压降,缺点为高温下漏电相对较大;在高压高效率要求下需权衡是否采用 MOSFET 同步整流或肖特基混合方案。

六、封装与可靠性建议

TO-277A 封装便于固定与热传导,安装时注意螺丝扭矩、介电垫片与绝缘片的使用以保证机械与电气安全;避免过度弯曲引脚与应力集中。储存与焊接应参照 LRC 的运输与回流/波峰焊指南,注意静电敏感性与长期热应力对器件参数的影响。

七、采购信息与替代建议

型号:SBR5100;品牌:LRC(乐山无线电);封装:TO-277A。若项目对漏电或导通电阻有更严格要求,可考虑同类 100V 级别的低 Vf 肖特基或在更高电流场景下采用并联多只器件或改用同步整流方案。

以上为 SBR5100 的产品概述与设计要点,供工程选型与电路设计参考。如需更详细的电气特性曲线、结壳热阻或典型应用电路,请提供需求,我可进一步整理器件数据与热性能计算示例。

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