WMSIC Electronic Components

LRC LESD8D5.0CT5G

ModelLESD8D5.0CT5G
PackageSOD-882
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LESD8D5.0CT5G
Type
LRC
Minimum package
10000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LESD8D5.0CT5G
Electronic Component
1
Package
SOD-882
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Cj- Capacitor
15pF
Electronic Component
BM0264683895
Operating Temperature
40℃~+125℃
Voltage
18.6V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
500nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LESD8D5.0CT5G瞬态抑制二极管产品概述

一、产品定位与核心身份

LESD8D5.0CT5G是乐山无线电(LRC)推出的双向ESD防护专用瞬态抑制二极管(TVS),采用0402小型化封装,专为5V供电系统的静电放电(ESD)及电快速瞬变脉冲群(EFT)干扰防护设计。其核心定位是在紧凑空间内实现对敏感电子器件的高效防护,同时兼顾系统信号完整性与功耗表现,适配消费电子、工业控制、车载电子等多场景需求。

二、关键电气参数深度解析

该器件的电气参数精准匹配低电压防护需求,核心指标可支撑可靠防护与系统兼容性:

  1. 静态工作参数:反向截止电压(Vrwm)为5V,与5V供电系统的工作电压完全匹配,正常工作时处于截止状态;击穿电压(Vbr)为5.6V,比Vrwm高0.6V,确保系统电压波动(≤5.6V)时不导通;反向漏电流(Ir)仅500nA,漏电流极低,对系统静态功耗影响可忽略。
  2. 瞬态防护参数:钳位电压(Vc)为18.6V(峰值脉冲电流下),可将瞬态过压限制在敏感器件的安全阈值内;峰值脉冲电流(Ipp)达9.4A(@8/20μs浪涌波形),峰值脉冲功率(Ppp)为150W(@8/20μs),能有效抑制常见ESD及EFT脉冲;结电容(Cj)为15pF,在0402封装中处于合理区间,对中低速信号(如UART、SPI)传输质量影响较小。

三、封装与环境适应性

  1. 封装特性:采用0402(英制0402/公制1005)表面贴装封装,尺寸仅1.0mm×0.5mm,适合高密度PCB设计(如便携设备、小型模块),可大幅节省电路板空间,适配集成度要求高的产品。
  2. 温度范围:工作温度覆盖-40℃至+125℃,满足工业级环境要求(如户外设备、车载电子),也可适配消费电子的宽温场景(如高温环境下的智能家居设备),可靠性经宽温测试验证。

四、防护能力与标准认证

LESD8D5.0CT5G的防护能力符合国际电磁兼容(EMC)核心标准:

  • ESD防护:支持IEC 61000-4-2标准,可有效抑制人体模型(HBM)、机器模型(MM)等ESD干扰,双向极性可同时应对正负瞬态电压;
  • EFT防护:符合IEC 61000-4-4标准,能快速响应电快速瞬变脉冲群干扰,避免脉冲电压对敏感器件造成不可逆损坏;
  • 防护机制:瞬态过压超过击穿电压时,器件快速导通,将过压钳位至安全值,瞬态能量通过器件泄放,保护后端电路不受冲击。

五、典型应用场景

该器件的性能特性使其适用于多种低电压系统:

  1. 低电压数字电路:5V供电的MCU、FPGA、单片机等核心控制单元的ESD防护;
  2. 通信接口:USB 2.0、UART、SPI、I2C等中低速通信接口的瞬态干扰防护;
  3. 传感器模块:工业温度/压力传感器、消费电子触控传感器的接口防护;
  4. 便携电子设备:智能手机、平板电脑、智能手环的充电/数据接口ESD防护;
  5. 工业与车载电子:工业控制模块、车载中控系统、胎压监测传感器的宽温防护场景。

六、总结

LESD8D5.0CT5G作为一款小型化双向ESD防护TVS,凭借精准的5V匹配参数、低漏电流、合理结电容及宽温适应性,成为5V供电系统ESD/EFT防护的优选器件。其符合国际EMC标准的防护能力,结合0402封装的紧凑设计,可满足高密度、宽温环境下的电子设备防护需求,适用于多领域产品的可靠性设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.