Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LESD8D12CBT5G
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LESD8D12CBT5G
- Type
- LRC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LESD8D12CBT5G
- Electronic Component
- 1
- Package
- SOD-882
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.01g
- Electronic Component
- 1
- Cj- Capacitor
- 9pF
- Electronic Component
- BM0264553418
- Voltage
- 17V
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 100nA
- Voltage(VBR)
- 16V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LESD8D12CBT5G 产品概述
一、主要特性
LESD8D12CBT5G 为 LRC（乐山无线电）推出的一款低工作电压 ESD 保护器件，适用于移动音频与数码相机等对低漏电与低电容敏感的信号线保护场景。主要电气参数如下：
- 反向截止电压 (Vrwm)：12 V
- 击穿电压 (VBR)：16 V
- 钳位电压：典型 17 V（Ipp 条件下）
- 峰值脉冲电流 (Ipp)：9 A @ 8/20 µs
- 峰值脉冲功率 (Ppp)：120 W @ 8/20 µs
- 反向电流 (Ir)：约 100 nA（超低漏电）
- 结电容 (Cj)：9 pF（低电容，适合音频与高速信号）
- 符合 IEC 61000-4-2：空气/接触放电 ±30 kV
- 材料与环保：RoHS 合规、无卤素
二、优势与应用场景
优势：
- 低工作电压与低钳位电压，能在保护同时最大限度减少对信号电平的影响；
- 超低泄漏电流（nA 级），适合对偏置与电流消耗敏感的便携设备；
- 9 pF 低电容特性可降低对音频与图像信号带宽与失真的影响；
- 满足 IEC 61000-4-2 高等级防护，可靠性高。
典型应用：
- 手机音频通道、耳机接口、麦克风输入；
- 数码相机的信号线、控制线与音视频接口；
- 便携设备的按键、I/O 端口、传感器接口等需要 ESD 保护的场合。
三、封装与选型注意
封装信息本描述中未标明，产品型号后缀通常涉及包装与封装形式。常见低电容 ESD 器件封装有 SOD-523、SOD-323 等小尺寸表贴封装。选型时请向供应商或数据手册确认实际封装、引脚排列与包装单位，以便 PCB 布局与自动化贴装。
四、PCB 布局与安装建议
- 将器件尽量靠近受保护的接口或连接器布置，确保最短的连接路径；
- 保护器的地端应做短且低阻抗的回流路径，建议单点接地或靠近系统地平面；
- 对高速或敏感信号可配合小阻值串联电阻以降低钳位瞬态能量；
- 避免在器件附近放置大面积的旁路电容直接并联在信号线上，以免增加瞬态耦合；
- 对焊盘进行良好热设计与锡量控制，保证焊接可靠性。
五、可靠性与测试
建议在量产前进行实际环境与系统级 ESD 测试，包含 IEC 61000-4-2 空气/接触放电与 8/20 µs 浪涌注入测试，验证器件在实际 PCB 布局下的钳位与能量承受能力。同时关注工作温度范围与长期漏电变化，必要时与供应商确认典型老化与温度特性曲线。
六、后续动作建议
- 获取并阅读 LESD8D12CBT5G 的完整数据手册，确认封装、引脚与机械尺寸；
- 在样板机上进行 ESD 与信号完整性验证；
- 与供应渠道确认供货状态、最小订购量及备件替代型号。
如需，我可帮您整理数据手册要点对比、推荐 PCB 封装脚位及提供一页样板电路参考图（适合贴片封装）。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
