Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LBZX84C2V4LT1G
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LBZX84C2V4LT1G
- Type
- LRC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LBZX84C2V4LT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Zener Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- (Zzt)
- 100Ω
- Electronic Component
- BM0227350630
- Diode
- 1
- Current(Ir)
- 50nA
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- 2.2V~2.6V
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LBZX84C2V4LT1G 产品概述
一、产品简介
LBZX84C2V4LT1G 是乐山无线电（LRC）推出的一款独立式稳压二极管，标称稳压值为 2.4V，允许范围 2.2V–2.6V。器件采用 SOT-23 小封装，适合空间受限且需低电流基准或保护的电子应用。器件工作结温范围宽（-55°C 至 +150°C），适用于工业级环境。
二、主要电气特性
- 标称稳压：2.4V（范围 2.2V–2.6V）
- 反向漏电流 Ir：典型 50nA（常温）
- 动态阻抗 Zzt：约 100Ω（测试条件下）
- 额定耗散功率：225mW（SOT-23 封装，具体以厂商资料和 PCB 散热为准）
- 工作结温：-55°C ～ +150°C
三、器件特性与影响
- 低漏电流使其适合高阻抗电路作电压基准或参考源，但由于 Zzt 较大（≈100Ω），在要求精密基准的场合需注意负载和校准误差。
- 封装功耗限制较小，长时间的较大电流工作会受限于封装及 PCB 散热能力。
- 温度系数存在，稳压电压会随结温变化，需在设计时考虑温漂影响。
四、典型应用场景
- 低功耗电压基准与偏置源（传感器、ADC 参考等）
- 过压/峰值钳位与输入保护
- 小电流电源分流与电平移位电路
- 便携设备与电池供电系统中简易稳压
五、使用与选型建议
- 工作电流选择：依据应用选择合适的稳流电阻 R；计算式 R = (Vin − Vz) / Iz，稳压管功耗 Pz = Vz × Iz <= Pd（并留安全裕量）。
示例：若 Vin=5V，希望 Iz=5mA，则 R ≈ (5−2.4)/5mA ≈ 520Ω，Pz ≈ 2.4V×5mA = 12mW（远低于封装额定）；若目标超大电流或长期运行，请检查 Pd 和 PCB 散热能力。 - 对于精密参考场合，推荐使用专用低漂移基准源，或在电路中加入温度补偿与校准。
- 在高阻输入处，Ir（50nA）虽小但仍可能影响极高阻抗电路读数，应并联适当阻抗或缓冲放大。
六、热管理与封装注意
SOT-23 封装散热能力有限，额定耗散功率受 PCB 铜箔面积、焊盘设计和环境温度影响。设计时应参考厂商热阻数据并考虑工作温度升高时的功耗降额。避免在高结温下长期以额定 Pd 工作，留有安全裕度。
七、封装与订购信息
- 封装形式：SOT-23（表面贴装）
- 型号：LBZX84C2V4LT1G
- 品牌：LRC（乐山无线电）
购买和替代时建议参阅完整规格书并确认测试条件（Iz、测试温度等）以确保在目标应用中的表现符合要求。
以上信息供产品选型和电路设计参考，具体电气参数与极限值请以厂家最新数据手册为准。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
