WMSIC Electronic Components

LRC EFM102

ModelEFM102
PackageDO-214AC(SMA)
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC EFM102
Type
LRC
Minimum package
7500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
EFM102
Electronic Component
1
Package
DO-214AC(SMA)
Electronic Component
General Purpose Diode
Electronic Component
0.11g
Electronic Component
1
Electronic Component
BM0264520311
Current
1A
Diode
Electronic Component
Current(Ir)
5uA
(Vf)
950mV
Electronic Component
50℃~+150℃
Electronic Component
Electronic Component
Electronic Component
7500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EFM102 通用二极管 产品概述

EFM102 是乐山无线电(LRC)推出的一款独立式通用整流二极管,采用 DO-214AC (SMA) 封装,适用于中低功率整流与保护用途。器件在设计上兼顾了低正向压降、较高反向耐压与可靠的温度特性,便于在开关电源、适配器和功率管理电路中替换或直接应用。

一、主要基础参数

  • 器件类型:独立式通用整流二极管(EFM102)
  • 品牌:LRC(乐山无线电)
  • 封装:DO-214AC (SMA)
  • 正向压降 (Vf):约 950 mV
  • 直流反向耐压 (Vr):100 V
  • 整流电流:1 A(额定)
  • 反向电流 (Ir):约 5 μA
  • 工作结温范围:-50 ℃ ~ +150 ℃

二、产品特点

  • 正向压降低:约 0.95 V 的正向压降有助于降低导通损耗,提高整流效率。
  • 适中耐压等级:100 V 的反向耐压满足大多数中低压电源与保护场景需求。
  • 低漏电流:反向电流约 5 μA,在待机或低功耗模式中可减少泄漏损耗。
  • 宽温度工作范围:-50 ℃ 到 +150 ℃ 的工作结温提升了在苛刻环境下的可靠性和适用性。
  • SMA 封装:DO-214AC(SMA) 提供良好的焊接性能和适合自动化贴装的外形。

三、典型应用场景

  • 开关电源(输出或整流)
  • 适配器与充电器中低压整流
  • 反向保护与极性保护电路
  • 自由轮二极管(在合适电流条件下)
  • 一般功率管理与去耦保护场合

四、热、可靠性与使用注意

  • 热管理:在接近 1 A 连续整流时应关注结温及封装的散热能力,必要时使用合适的 PCB 铜箔面积与散热设计以降低结温。
  • 测试条件:正向压降与反向电流等参数受测试条件(如测试电流、温度)影响,选型时建议参照数据手册的详细曲线。
  • 环境适应性:器件支持较宽工作温度,适合工业级应用;在高温或高湿环境中,焊接与封装完整性需按标准工艺控制。

五、选型建议

  • 电压裕量:系统工作电压应留有安全裕量,高于最大工作电压选择更高 Vr 的型号以提高可靠度。
  • 功率损耗评估:根据 Vf 与通过电流计算导通损耗(Pd ≈ Vf × I);若持续功率高,需改善散热或选用更大封装/更低 Vf 的器件。
  • 漏电容/开关性能:若用于高频整流或快速切换场合,需关注二极管的恢复特性(本型号为通用整流器件,若对恢复时间有严格要求,请参考具体数据或选择快恢复/肖特基二极管)。

六、典型电路与布板建议

  • 在整流与保护位置,确保焊盘与铜箔面积足够以利散热,关键走线应短而宽以降低寄生电阻。
  • 对于反向保护或开关电路,建议在二极管附近放置适当的去耦电容与吸收元件以抑制尖峰电压与电磁干扰。
  • 焊接工艺按 SMA 封装要求执行,注意回流曲线与冷却速率,避免热应力导致封装裂纹。

七、采购与技术支持

订购时请注明型号 EFM102、封装 DO-214AC(SMA) 与所需数量,并向供应商索取完整数据手册与可靠性文件。LRC(乐山无线电)授权经销商或技术支持可提供更详细的电气特性曲线、封装尺寸图与应用参考电路。

如需针对特定应用进行热设计建议、PCB 布局优化或更严格的电气参数(如脉冲浪涌电流、结温–正向压降曲线等),可提供具体工况,我将基于这些条件给出更精确的设计建议。

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