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LRC LM3Z36VT1G
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LM3Z36VT1G
- Type
- LRC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LM3Z36VT1G
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.027g
- Electronic Component
- 1
- (Zzk)
- 500Ω
- (Zzt)
- 90Ω
- Electronic Component
- BM0226545634
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 34V~38V
- Electronic Component
- 65℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM3Z36VT1G 产品概述
一 概述
LM3Z36VT1G 是乐山无线电（LRC）推出的一款独立式小功率稳压二极管，标称稳压值 36V，允许稳压范围 34V～38V。器件采用 SOD-323 表面贴装封装，适合对体积、成本和稳定电压有要求的便携和板载电路。最大耗散功率为 200mW，工作结温范围宽 (-65℃ ～ +150℃)，在通常低功耗稳压、基准和过压保护等场合具有良好适用性。
二 主要特性
- 类型：独立式稳压二极管（Zener / TVS 类似用途，按资料规格）
- 标称稳压：36V（允许范围 34V ～ 38V）
- 最大耗散功率 Pd：200mW（封装及散热条件下）
- 工作结温范围：-65℃ ～ +150℃
- 低反向电流：Ir = 50nA @ 25.2V（漏电流小，适合要求低模数电流环境）
- 阻抗：Zzk = 500Ω；Zzt = 90Ω（按出厂资料给出）
- 封装：SOD-323（表面贴装，体积小，便于自动贴片生产）
- 品牌：LRC（乐山无线电）
三 典型电气参数与使用换算
- 最大稳压电流的近似估算：在理想条件下，最大允许稳压电流可由 Iz_max ≈ Pd / Vz 估算。以 Vz = 36V 和 Pd = 200mW 计算，Iz_max ≈ 200mW / 36V ≈ 5.6mA（仅为近似值，实际允许电流应考虑封装热阻、环境温度与 PCB 散热条件）。
- 低漏电流特性（50nA @ 25.2V）说明在高阻抗或待机电路中引入的静态耗电极小。
- 阻抗指标表明器件在不同测试点或不同工作电流下的动态响应特性，设计时需结合具体应用电流点参考器件详细数据手册。
四 封装与物理特性
SOD-323 小型封装适合高密度贴片电路，便于自动化生产与空间受限方案。由于 Pd 仅 200mW，封装本身散热能力有限，建议在 PCB 设计时预留适当的铜箔面积或靠近热地以改善热流散布。
五 典型应用
- 低功耗电路的稳压/基准电源（小电流稳压源）
- 过压保护与箝位（需评估瞬态能量吸收能力）
- 仪表、传感器及便携设备中的参考电压
- 需要低泄漏电流的偏置或检测电路
六 使用与注意事项
- 严格控制通过二极管的稳压电流，建议在实际应用中保留足够裕量，避免长期接近 Pd 极限；若工作电流接近计算值，应优化 PCB 散热或换用更高功耗封装。
- 对于瞬态浪涌或高能脉冲，须评估器件的瞬态承受能力，必要时并联限流或采用专用 TVS 器件。
- 焊接与回流：遵循 SOD-323 相关封装的回流温度曲线和制造商焊接推荐，避免过热造成器件损伤。
- 环境与可靠性：工作在高温环境时需按热阻特性降额使用，保障长期稳定性。
七 结论
LM3Z36VT1G 提供了标称 36V 的稳压输出，低漏电特性与小型 SOD-323 封装使其在低功耗、空间受限的电路中具有应用价值。设计时应充分考虑其 200mW 的耗散限制与封装散热能力，适当留有余量或选择热性能更优的解决方案以满足可靠性要求。
（注：以上参数基于提供的规格信息，具体应用前建议参考器件完整数据手册以获取典型曲线、测试条件与详细热性能数据。）
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