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LRC S3MB
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC S3MB
- Type
- LRC
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- S3MB
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.187g
- Electronic Component
- 1
- Electronic Component
- BM0226466800
- Current
- 3A
- Diode
- Electronic Component
- Current(Ir)
- 5uA
- (Vf)
- 1.1V
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S3MB 通用整流二极管 — 产品概述
一、主要参数概述
S3MB 为乐山无线电（LRC）推出的独立式通用整流二极管，适用于中高压整流场合。关键电气参数如下：
- 二极管配置：独立式
- 正向电流（整流）：3A（连续）
- 非重复峰值浪涌电流（Ifsm）：80A
- 直流反向耐压（Vr）：1000V（1kV）
- 正向压降（Vf）：约1.1V（额定电流下）
- 反向漏电流（Ir）：约5µA（典型/室温）
- 工作结温范围：-50℃ ~ +150℃
- 封装：SMB（常见为 DO-214AA）
二、产品特性与优势
- 高压耐受：1kV 的反向耐压适合中高压电源和整流场合，能替代一些更大型号的高压二极管。
- 良好的冲击承受能力：80A 的非重复峰值浪涌电流使其在开机充电、浪涌脉冲场景下更可靠。
- 中等正向压降：约1.1V 的正向压降在 3A 级别下属于合理范围，有利于控制功耗与温升。
- 宽温度范围：-50℃ 至 +150℃ 的结温范围，适应工业环境与一些苛刻的使用条件。
- SMB 封装：便于手工焊接和波峰/回流焊工艺，且散热性能较小型封装更优。
三、封装与散热建议
SMB（DO-214AA）封装提供一定的散热路径，但在实际应用中仍需注意：
- 在长期 3A 连续工作时，应在 PCB 上留足铜箔散热面积（尤其是焊盘与地/电源平面相连）。
- 对于频繁冲击或高环境温度，应进行电流降额或加装散热片、强制风冷。
- 注意焊接工艺：避免长时间高温回流，防止封装应力。
四、典型应用场景
- 开关电源与整流桥电路的中高压整流单元；
- 工业电源、LED 驱动、充电器与适配器；
- 电机驱动、逆变器与再生制动系统的回流保护；
- 含有浪涌充电或开机电流冲击的电路（如电容充电回路）。
五、设计与使用注意事项
- 反向漏电流为微安级，若在高温或高压下使用，应参照数据手册中 Ir 随温度、耐压的曲线进行设计裕量。
- 若需更高连续电流，建议并联时加入小电阻以均流，或选用额定电流更高的封装/器件；并联时注意热均衡与版图对称。
- 对于对开关速度或恢复特性敏感的应用（例如高频逆变），如需更低恢复损耗可考虑肖特基或快速恢复二极管。
- 采购买样或量产前，请向供应商索取完整数据手册、冲击测试与可靠性报告。
六、采购与替代建议
S3MB 为 LRC（乐山无线电）品牌，常见于电子元器件分销渠道与代理商库存。选型时可根据实际需求在耐压、峰值浪涌和正向压降之间权衡；若关注更低 Vf 或更快恢复特性，可在型号族内或同封装的肖特基/快速恢复器件中寻找替代。
如需更详细的电气特性曲线、封装尺寸和焊盘推荐，请提供欲采购的数量与应用环境，我可协助查询或列出更精确的设计建议。
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