WMSIC Electronic Components

LRC LBZX84C3V6LT1G

ModelLBZX84C3V6LT1G
PackageSOT-23(SOT-23-3)
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LBZX84C3V6LT1G
Type
LRC
Minimum package
3000

Technical parameters

Electronic Component
LRC
Electronic Component
LBZX84C3V6LT1G
Electronic Component
1
Package
SOT-23(SOT-23-3)
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
(Zzt)
90Ω
Electronic Component
BM0230643468
Diode
1
Current(Ir)
5uA
Power Dissipation(Pd)
300mW
Electronic Component
3.4V~3.8V
Electronic Component
55℃~+150℃
Electronic Component
3000
Electronic Component
3.6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LBZX84C3V6LT1G 产品概述

一、产品简介

LBZX84C3V6LT1G 为乐山无线电(LRC)出品的独立式稳压二极管,典型稳压值为 3.6V,标称范围 3.4V ~ 3.8V。器件采用 SOT-23 小封装,适合表面贴装的便携与空间受限产品,用作低压参考、基准稳压、浪涌钳位与偏置电路。

二、主要电气参数

  • 稳压值(标称):3.6V(范围 3.4V ~ 3.8V)
  • 反向电流 Ir:5 μA(典型/最大值取决于测试条件)
  • 阻抗 Zzt:90 Ω(动态阻抗,影响调节特性与噪声)
  • 耗散功率 Pd:300 mW(封装热限制下的额定功率;文档中亦有 225 mW 的常见标注,实际应用请以厂商数据手册及环境散热条件为准)
  • 工作结温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23(SOT-23-3)
  • 器件形式:独立稳压二极管(单体)

三、性能要点与影响因素

  • 动态阻抗为 90 Ω,说明在稳压区电流变化会显著影响输出电压:电流每变化 1 mA,电压约变化 90 mV(近似)。因此该型号更适合用于低精度参考或作为钳位/偏置元件,而非精密基准源。
  • 反向漏电 5 μA 在高阻抗电路或高温场景下可能影响偏置点,低漏电需求时需注意选择更低漏电元件。
  • 耗散功率受封装和 PCB 散热面积影响,实际允许的稳压电流应按 Pd/Vz 计算并做温度折算(例如理论最大 Iz ≈ Pd / Vz)。若使用 300 mW,Iz_max ≈ 83 mA;若按 225 mW,则 Iz_max ≈ 62.5 mA。但这只是理论值,实际应用须考虑结温与环境散热,建议远低于此极限并在数据表中查温度降额曲线。

四、典型应用场景

  • 低功耗电子设备的基准电压和偏置网络
  • 电源输入的过压/浪涌钳位保护
  • 模拟前端小信号偏置、参考电压源(非高精度场合)
  • 便携式仪器、传感器接口与通信模块的简单稳压设计

五、选型与使用建议

  • 若需要较稳定、低噪声的参考,请改用精密基准源;本器件更适合对误差容忍度较大的应用。
  • 使用限流电阻配合稳压二极管:R = (Vs - Vz) / Iz,电阻功耗 PR = (Vs - Vz) * Iz。示例:若 Vs = 5V、目标 Iz = 5 mA,则 R ≈ 280 Ω,PR ≈ 7 mW,且二极管耗散约 3.6V * 5 mA = 18 mW。
  • 注意热降额与 PCB 设计:增加铜箔面积、靠近散热面或增加过孔可改善散热性能,提高可靠工作电流上限。
  • 在高温或高漏电敏感场合,需额外验证工作点与温漂。

六、封装与可靠性

SOT-23 小型封装适合表面贴装自动化生产,体积小、成本低。工作结温范围宽,可满足大多数工业与民生电子应用,但在高功耗场合需通过 PCB 散热设计保证结温不超限。

总结:LBZX84C3V6LT1G 提供了体积小、成本低的 3.6V 稳压解决方案,适用于对精度要求不高的偏置与保护场合。选型时请结合实际工作电流、环境温度与散热条件,并参照厂商完整数据手册以获得准确的测试条件与温度折算信息。

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