WMSIC Electronic Components

LRC LMBT4403WT1G

ModelLMBT4403WT1G
PackageSC-70
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LMBT4403WT1G
Type
LRC
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LMBT4403WT1G
Electronic Component
1
Package
SC-70
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0264600912
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
200MHz
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMBT4403WT1G 产品概述

一、概述

LMBT4403WT1G 是一颗高频小功率 PNP 双极型晶体管,由 LRC(乐山无线电)提供,采用 SC-70 超小封装,适合对空间和成本敏感的便携或密集布局电路。该器件支持集电极电流 Ic 最大 600mA,集—射极击穿电压 Vceo 为 40V,适用于低压到中压电路中的开关与放大应用。

二、主要电气特性

  • 晶体管类型:PNP
  • 最大集电极电流 Ic:600 mA
  • 集—射极击穿电压 Vceo:40 V
  • 最大耗散功率 Pd:150 mW(封装限制,需注意热管理)
  • 直流电流增益 hFE:约 30(中等放大倍数)
  • 特征频率 fT:200 MHz(适应高速开关/小信号放大)
  • 集电极截止电流 Icbo:100 nA(低漏电特性)
  • 集—射极饱和电压 VCE(sat):约 400 mV(在饱和导通时压降)
  • 射—基极击穿电压 Vebo:5 V
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SC-70(紧凑型,适合表贴工艺)

三、主要特性与优势

  • 高频性能良好:fT 达 200 MHz,适合高频率小信号放大与快速开关。
  • 中等电流能力:600 mA 的 Ic 在小封装下提供较好的驱动能力,适合驱动小负载或作为信号级开关。
  • 低漏电流:Icbo 100 nA,保证在高阻态下的低泄漏和稳定性。
  • 工作温度宽:-55 ℃ 至 +150 ℃,适配严苛环境应用。

四、典型应用场景

  • 便携设备的开关与驱动电路;
  • 小信号放大器与射频前端电路;
  • 数字电路中的高频开关或电平转换;
  • 空间受限的消费电子与通信终端。

五、封装与可靠性

SC-70 封装体积小、焊接方便,适合批量表面贴装。由于 Pd 仅 150 mW,推荐在 PCB 设计中尽量减低集电极—发射极压降并通过合适的铜箔面积与热传导路径进行散热设计,避免长期高功耗工作导致封装过热。

六、使用注意事项

  • 避免基极—射极电压超过 Vebo(5 V),以防基区损伤;
  • 注意功耗和结温限制,必要时采用降额使用(derating);
  • 在高频应用中注意寄生电容与布局走线,优化走线和旁路电容以获得稳定性能。

该器件为单只包装(数量:1 个 PNP),在选型与设计时请结合实际测试条件(温度、频率、工作点)验证性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.