WMSIC Electronic Components

LRC SZA20A

ModelSZA20A
PackageSMA
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC SZA20A
Type
LRC
Minimum package
7500 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
SZA20A
Electronic Component
1
Package
SMA
Electronic Component
Zener Diode
Electronic Component
0.11g
Electronic Component
1
(Zzt)
22Ω
Electronic Component
BM0264353287
Diode
1
Current(Ir)
2uA
Power Dissipation(Pd)
1W
Electronic Component
19V~21V
Electronic Component
50℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SZA20A稳压二极管产品概述

一、产品基本定位与核心标识

SZA20A是乐山无线电(LRC) 推出的表面贴装稳压二极管,属于中压标准化稳压器件范畴。型号中“20A”明确其标称稳压值为20V,是针对小型化、宽温环境应用设计的通用型稳压元件,广泛适配仪器仪表、工业控制、便携设备等场景。

二、关键电气性能参数解析

核心参数直接决定器件的应用边界与性能表现,具体如下:

  1. 稳压特性:标称稳压值20V,允许偏差范围19V~21V(满足通用稳压场景的精度需求);动态阻抗Zzt=22Ω(反映稳压时电压随电流变化的敏感度,低阻抗意味着输出电压更稳定)。
  2. 功耗与漏电:最大耗散功率Pd=1W(支持中等功率的稳压/保护应用);反向漏电流Ir=2uA(典型值)(反向偏置下漏电极小,可降低电路静态损耗,适合低功耗设计)。
  3. 温度适应性:工作结温范围覆盖**-50℃~+150℃**(宽温特性可满足户外、工业现场等极端温度环境的使用需求,器件性能在宽温内保持稳定)。

三、封装与物理特性

采用DO-214AC(SMA)表面贴装封装,具有以下优势:

  • 尺寸紧凑:典型尺寸约2.0mm×3.8mm×1.5mm,大幅节省PCB布局空间,适配便携设备、小型电源模块等对体积要求严格的场景;
  • 贴装兼容:支持自动化贴装生产线,生产效率高;
  • 耐高温:封装材料可兼容常规回流焊、波峰焊工艺(焊接峰值温度≤260℃,时间≤10秒),可靠性强。

四、典型应用场景

SZA20A的参数特性使其适配多种实用场景:

  1. 基准电压源:提供稳定的20V参考电压,用于ADC/DAC、仪器仪表的基准输入,确保测量与转换精度;
  2. 过压保护:并联于直流电源输出端,当电压超过稳压值时快速击穿,限制电压峰值,保护MCU、传感器等敏感器件;
  3. 简易稳压电路:配合电阻、晶体管构成低成本稳压模块,调整输出电压至20V左右,适用于低要求电源设计;
  4. 工业控制:宽温特性可用于PLC、变频器等工业设备的辅助稳压模块,适应车间高低温环境。

五、可靠性与选型价值

  • 品牌保障:LRC作为国内知名半导体厂商,SZA20A经高低温循环、湿热老化、静电放电等严格测试,质量稳定;
  • 标准化设计:SMA封装为行业通用规格,便于库存管理与替换,降低供应链成本;
  • 参数明确:稳压范围、阻抗等参数清晰,便于电路设计前期计算(如限流电阻配置),减少后期调试工作量。

六、使用注意事项

  1. 限流电阻配置:必须串联限流电阻,避免稳压管过流损坏。电阻值计算公式为:
    $$R = \frac{V_{cc} - V_z}{I_z}$$
    其中$I_z$需小于$\frac{P_d}{V_z}=50mA$,确保功耗不超过1W;
  2. 静电防护:稳压二极管对静电敏感,操作时需佩戴防静电手环,储存于防静电包装中;
  3. 焊接规范:焊接温度需控制在工艺范围内,避免高温损坏器件内部结构。

SZA20A以其稳定的稳压性能、宽温适应性与紧凑封装,成为中压稳压/保护场景的高性价比选择,可满足多数通用电子设备的设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.