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LRC HFMAF109
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC HFMAF109
- Type
- LRC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- HFMAF109
- Electronic Component
- 1
- Package
- SMA-FL
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.06g
- Electronic Component
- 1
- Electronic Component
- BM0227656574
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 5uA
- (Vf)
- 1.85V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 1.2kV
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HFMAF109 产品概述
一、产品简介
HFMAF109 是 LRC（乐山无线电）推出的一款通用独立式二极管，定位于高电压、低至中等电流的整流与保护场景。器件以 SMA-FL 小型封装提供，便于电路板布局与批量生产，适合在体积受限但要求较高耐压的应用中使用。
二、主要参数
- 二极管配置：独立式（单只二极管）
- 正向压降（Vf）：1.85 V（参考值）
- 直流反向耐压（Vr）：1.2 kV
- 反向电流（Ir）：5 μA（典型，在额定反向电压附近）
- 平均整流电流：1 A
- 品牌：LRC（乐山无线电）
- 封装：SMA-FL
三、性能特点
- 高耐压：1.2 kV 的反向耐压使其能胜任高压整流与阻断任务。
- 低反向泄漏：典型反向电流仅 5 μA，有利于高阻抗、低漏电流电路的稳定。
- 中等正向压降：约 1.85 V，在耐压与导通性能之间取得平衡。
- 小型封装：SMA-FL 封装便于表贴安装，适合批量自动化贴装。
四、典型应用场景
- 高压整流电源与分压供电（低至中等负载）
- 电子计量、测试设备的高压侧保护与整流
- 光电、光电倍增管（PMT）等需高压偏置的外围电路
- 抗浪涌、反向保护与离散高压开关应用
五、封装与可靠性建议
SMA-FL 为常见的表面贴装封装，适用回流焊工艺。由于器件在高压或较高整流电流下可能产生热量，建议：
- 在设计 PCB 时留出适当散热铜箔与通孔，以降低结温；
- 若长期 1 A 连续工作，需评估封装允许的功耗并考虑散热措施；
- 遵循制造商推荐的回流焊温度曲线，避免过热损伤封装和内部结构。
六、选型与使用注意事项
- 如果实际工作电流、峰值电流或开关频率高于常规整流条件，应选择更大功率或专用快恢复/肖特基器件；
- 在高湿或腐蚀环境使用时，注意封装密封性与清洁，防止表面漏电路径；
- 对于精密测量与超低漏电要求的场合，应核查在所用工作电压下的实际漏电值；
- 安装前确认器件批次与规格一致，必要时做样机验证。
七、结语
HFMAF109 以其 1.2 kV 的高耐压、低泄漏和便捷的 SMA-FL 封装，适合多种高压低至中等电流的整流与保护应用。选用时请结合实际工作条件（电流、温升、开关特性）进行热设计与电气验证，确保长期可靠运行。若需更详细的电气特性曲线与热参数，建议向 LRC 查询完整数据手册。
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