WMSIC Electronic Components

LRC S-LRB520S-40T1G

ModelS-LRB520S-40T1G
PackageSOD-523
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-LRB520S-40T1G
Type
LRC
Minimum package
5000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
S-LRB520S-40T1G
Electronic Component
1
Package
SOD-523
Electronic Component
Schottky Diode
Electronic Component
0.023g
Electronic Component
1
Electronic Component
BM0264999492
Current
200mA
Diode
1
Current(Ir)
1uA
(Vf)
390mV
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LRC S-LRB520S-40T1G肖特基二极管产品概述

一、产品核心定位与品牌背景

LRC S-LRB520S-40T1G是乐山无线电(LRC)推出的小信号肖特基整流二极管,针对低功耗、高密度集成的电子设备需求设计,以「低正向压降+小封装+宽温可靠性」为核心优势,覆盖便携电子、物联网、小型电源等多领域应用。

乐山无线电作为国内老牌半导体厂商,深耕分立器件领域超50年,其产品通过AEC-Q101(汽车级)、MIL-STD(军工级)等认证,S-LRB520S-40T1G继承了LRC的可靠性基因,适合对性能与成本平衡要求较高的量产场景。

二、关键电气参数深度解析

该器件的核心参数围绕「低功耗、宽适配」设计,关键指标如下:

参数 数值 实际意义 正向压降(Vf) 390mV 远低于传统硅二极管(0.7V),相同电流下功耗降低约44%,适配电池供电设备 直流反向耐压(Vr) 40V 满足大多数低电压电路的反向阻断需求,无需额外串联高压器件 持续整流电流(If) 200mA 稳定承载日常小信号电路的工作电流,适配便携设备的电源路径管理 反向漏电流(Ir) 1μA 反向偏置下几乎无额外功耗,进一步提升电路效率,延长电池续航 工作结温范围 -55℃~+125℃ 覆盖工业级与汽车电子辅助电路的宽温要求,极端环境下仍稳定工作 非重复峰值浪涌电流 1A(8.3ms) 应对电路启动瞬间的脉冲冲击,降低器件损坏风险

三、封装与可靠性设计特点

采用SOD-523封装(又称0402封装),尺寸仅1.0mm×0.6mm×0.45mm,是超小型表面贴装封装之一,具备以下优势:

  1. 空间节省:适配对尺寸敏感的可穿戴设备、智能传感器等产品,PCB布局密度提升30%以上;
  2. 可靠性优异:封装材料采用高温稳定性塑料,配合LRC成熟的模塑工艺,抗机械应力(跌落测试符合JEDEC标准)与温度循环性能突出;
  3. 焊接兼容性:支持回流焊、波峰焊(需适配治具),焊接温度曲线符合J-STD-020国际标准,量产良率稳定。

四、典型应用场景

该器件的参数特性使其在多场景下具备替代优势:

  1. 便携电子终端:智能手机、智能手环、蓝牙耳机的电源路径切换与续流电路,低压降减少电池能量损耗;
  2. 物联网传感器节点:低功耗温湿度、运动传感器的信号整流与电源管理,1μA漏电流可延长电池续航15%以上;
  3. 小型DC-DC转换器:作为续流二极管,其快速恢复特性(肖特基二极管典型恢复时间<100ns)适配高频(1MHz以上)转换,提升效率3%-5%;
  4. 汽车电子辅助电路:车载中控的小信号处理电路(如USB接口电源切换),-55℃+125℃宽温覆盖车载环境(-40℃+85℃);
  5. 通信接口电路:USB Type-C、Micro-USB的电源切换电路,小封装适配接口的高密度布局。

五、选型与使用注意事项

  1. 参数匹配:持续工作电流需控制在200mA以内,反向电压不得超过40V,避免过流/过压损坏;
  2. 温度管理:结温超过125℃时漏电流会显著增大,建议通过PCB布局增加散热铜箔,或降额使用(工作电流≤150mA);
  3. 浪涌防护:虽有1A浪涌能力,但避免频繁出现超额定脉冲,必要时并联TVS二极管(如SMBJ40CA);
  4. 焊接工艺:回流焊峰值温度需控制在240-260℃(10-30s),手工焊接需使用恒温烙铁(≤350℃,时间≤3s),避免封装变形。

综上,LRC S-LRB520S-40T1G以「低功耗、小封装、高可靠性」为核心竞争力,是低电压小信号电路的高性价比选型,尤其适合对尺寸与效率要求严格的量产产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.