WMSIC Electronic Components

LRC LRX102UT1G

ModelLRX102UT1G
PackageSC-88
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LRX102UT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LRX102UT1G
Electronic Component
1
Package
SC-88
Electronic Component
Digital Transistor
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0264570933
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
100mA
Output Voltage(VO(on))
300mV@10mA,0.5mA
Current (h FE)
80@10mA,5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LRX102UT1G 产品概述

一、产品简介

LRX102UT1G 是乐山无线电(LRC)推出的一款数字晶体管(内置基极电阻的 NPN 晶体管),采用 SC-88 小型贴片封装,面向低电压逻辑接口与小功率开关应用。器件集成了驱动电阻,便于直接与微控制器或逻辑门输出相连,显著简化外围电路并节省 PCB 空间。

二、主要电气参数(典型/最大值)

  • 集—发击穿电压 Vceo:50 V
  • 集电极电流 Ic(最大):100 mA
  • 耗散功率 Pd:200 mW(封装热限制,需注意 PCB 散热)
  • 直流电流增益 hFE:80(测量条件 Ic=10 mA,VCE=5 V)
  • 输入导通电压 VI(on):2.8 V @ Iin=5 mA(厂方注释测量条件)
  • 输入截止电压 VI(off):最大 1.2 V @ Iin=0.1 mA(测量条件 VCC=5 V)
  • 输出饱和电压 VO(on):300 mV @ Ic=10 mA(典型)
  • 工作温度范围:-55 ℃ ~ +150 ℃

(以上参数以厂方规格为准,实际设计中请参考完整数据手册并在目标温度/频率下验证。)

三、器件特点与优势

  • 内置基极电阻:免去了外部基极限流电阻,简化设计,降低零件数。
  • 低饱和电压:在 10 mA 等级下 VO(on) 约 300 mV,可减少功耗与发热。
  • 宽工作电压:50 V 的 Vceo 允许用于较高电压的低侧开关场合。
  • 小型封装:SC-88 占板面积小,适合空间受限的便携或密集电路板。
  • 宽温度范围:适用于工业级环境。

四、典型应用场景

  • MCU/逻辑电平直接驱动:用作 5 V 或 3.3 V 逻辑的低侧开关,驱动指示灯、继电器驱动器的前级等。
  • 指示 LED 驱动与电平转换:通过内置电阻可直接驱动小电流 LED。
  • 信号放大与缓冲:作为逻辑信号的缓冲器或电平提升/下降器。
  • 小功率负载开关:用于控制蜂鸣器、小电机、继电器线圈的驱动前端(注意电流与功耗限制)。

五、使用要点与热管理

  • 功耗与散热:Pd 为 200 mW,实际功耗由 Ic×VCE 决定。连续大电流工作时需保证良好 PCB 散热或降低占空比。
  • 输入驱动:依据 VI(on) 与 VI(off) 参数选择合适的驱动电平与限流策略,避免输入不确定区间(介于 1.2 V ~ 2.8 V)产生误动作。
  • 保护建议:对感性负载应并联反向保护二极管或采用外部吸收元件,以防反向峰值电压损坏器件。
  • PCB 布局:尽量缩短集电极与发射极的走线,使用较宽铜箔以帮助散热。

六、封装与选型建议

LRX102UT1G 提供 SC-88 小型 SMD 封装,适合表贴生产与自动化焊接。选型时重点关注最大集电极电流 100 mA 与功耗 Pd,若负载电流接近上限,应考虑更大功率或采用并联/外部限流方案。

七、可靠性与环境适应

器件工作温度范围宽(-55 ℃ ~ +150 ℃),适合工业级应用。为保证长期可靠性,建议在高温环境下按厂方提供的功率降额曲线进行设计,并通过实际环境应力测试验证。

总结:LRX102UT1G 是一款集成基极电阻的 NPN 数字晶体管,特点是封装小、接口方便、适用于低功耗开关与逻辑驱动场合。在使用时需注意功耗与散热约束,并根据实际工作点参考完整数据手册进行验证与布局。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.