WMSIC Electronic Components

LRC S-LMBR140FT1G

ModelS-LMBR140FT1G
PackageSOD-123FL
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-LMBR140FT1G
Type
LRC
Minimum package
3000

Technical parameters

Electronic Component
LRC
Electronic Component
S-LMBR140FT1G
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.037g
Electronic Component
1
Electronic Component
BM0230027925
Current
1A
Diode
1
Current(Ir)
500uA@40V
(Vf)
550mV@1A
Electronic Component
55℃~+150℃
Electronic Component
3000
Voltage Rating(Vr)
40V
Surge Current (Ifsm)
30A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S-LMBR140FT1G 产品概述

一、产品简介

S-LMBR140FT1G 为 LRC(乐山无线电)生产的一款肖特基势垒二极管,封装为 SOD-123FL。该器件以低正向压降和快速恢复特性为主要优势,适用于各种低压、高效率的电源及保护电路。关键参数:正向压降 Vf = 0.55V @ 1.0A;直流反向耐压 Vr = 40V;反向电流 Ir = 500µA @ 40V;非重复峰值浪涌电流 Ifsm = 30A;结温工作范围 -55℃~+150℃。

二、主要特性

  • 低正向压降(0.55V@1A),降低整流损耗,提高效率。
  • 肖特基结型,具有极短的恢复时间,适合高速开关场合。
  • 中等反向漏电(500µA@40V),在多数低压电源与保护应用中可接受。
  • 封装 SOD-123FL,体积小、适合表贴化批量生产与自动贴装回流焊。
  • 宽工作温度范围,适应工业级环境。

三、典型应用场景

  • 开关电源的输出整流与续流二极管(尤其在 1A 左右负载下表现良好)。
  • DC-DC 降压转换器的整流与回路保护。
  • 电池充放电路径的反向保护与防反接电路。
  • 便携设备与通信设备的低压功率管理。
  • 二极管作为钳位、夹位元件用于抑制电压尖峰。

四、封装与 PCB 布局建议

SOD-123FL 为低剖面表面贴装封装,焊接性能良好。为保证热性能与可靠性,建议:

  • 在焊盘下方及周围留足铜箔散热区,并可配合过孔导热至多层板内层或底层铜。
  • 焊盘设计遵守厂商推荐尺寸,缩短走线以降低寄生感抗与热阻。
  • 回流焊工艺参数参照无铅回流曲线,避免过高峰值温度或超时。

五、可靠性与选型要点

  • 30A 的 Ifsm 表示短时浪涌能力,适合瞬态浪涌保护,但不宜长期承受大电流。
  • 500µA 的反向电流在高温下会增加,敏感应用需评估漏电带来的功耗与发热。
  • 若系统电压接近或超过 40V,应选用更高 Vr 的器件。
  • 对于严苛热环境或更高效率要求,可与其它低 Vf 或更大功率封装的肖特基做对比评估。

六、结论

S-LMBR140FT1G 在中低压、1A 级别的整流与保护应用中提供了可靠的低压降与快速响应特性。结合 SOD-123FL 小型化封装,适合消费电子、通信与工业控制等需兼顾体积与效率的场合。选型时应关注工作电压裕度与散热布局,以充分发挥器件性能。

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