Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LRB521S-40T1G LRB521S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LRB521S-40T1G
- Type
- LRC
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LRB521S-40T1G
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.025g
- Electronic Component
- 1
- Electronic Component
- BM0127472089
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 20uA
- (Vf)
- 300mV
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：LRB521S-40T1G 肖特基二极管
一、产品简介
LRB521S-40T1G 是由乐山无线电（LRC）公司生产的一款高性能肖特基二极管，具有优良的高频性能和低正向压降特性。该产品专为广泛的电子应用设计，尤其在需要快速开关和高效率的电源管理场合表现卓越。LRB521S-40T1G 提供极低的正向电压降（300mV ）、小的反向漏电流（20µA）和较高的耐压（40V），使其成为高效电源转换系统的重要组成部分。
二、基本技术参数
- 正向压降 (Vf): 300mV @ 200mA，表明它在导通状态下损耗较少的电压，有助于提高整体能效。
- 耐压 (Vr): 40V，适用于中等电压应用，确保在高频率开关和高电压下的稳健性能。
- 反向漏电流 (Ir): 20µA，这一参数表明该二极管在反向偏置情况下的能量损耗非常低，有助于延长电池寿命和增强系统效率。
- 最大正向电流 (If): 200mA，适合于各类小功率电源和电路中。
三、封装与尺寸
LRB521S-40T1G 采用 SOD-523 的封装形式，这种小型表面贴装封装具备优秀的热管理能力和空间利用率。SOD-523 封装为紧凑型设计，特别适合于空间有限的应用，如移动设备、通信设备及便携电子产品等。这种封装可以显著降低生产成本，并提高自动化组装的效率。
四、应用领域
LRB521S-40T1G 的优异性能使其广泛应用于多个领域，包括但不限于：
- 开关电源：在电源转换过程中，肖特基二极管可用于提升转换效率，降低能量损耗。
- 整流电路：在整流器中用于将交流信号转换为直流信号，广泛应用于各种电源适配器和电源模块。
- 保护电路：作为过压和反向极性保护元件，有效防止对电路的损坏。
- LED驱动电路：在LED驱动应用中，能够提供高效电流控制。
- 通信设备：因其低正向压降和高效性能，适合于高频信号的处理和转换。
五、性能优势
- 低正向电压: 对于要求高效率的电路，LRB521S-40T1G 的低正向压降明显减少了电能损耗，提升了整体系统的能效。
- 高频响应: 肖特基二极管的快速恢复特性使其在高频开关应用中表现优异，能够快速响应电流变化，减少延迟和不必要的能量浪费。
- 高可靠性: 该二极管经过严格的测试和质量控制，确保其在不同工作环境中的可靠性，使其适用范围广泛。
六、结论
LRB521S-40T1G 是一款高效、可靠的肖特基二极管，设计用于提高电子产品的性能和效率。在当今广泛应用于电源管理、整流及保护电路的背景下，其优越的技术参数及灵活的应用场景使其成为电子工程师进行项目设计和产品开发的理想选择。无论是在消费电子、通讯设备还是工业应用领域，LRB521S-40T1G 都能提供卓越的性能。通过选择该产品，工程师不仅能够提高产品的效能，还能有效降低能耗，助力可持续发展。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
