WMSIC Electronic Components

LRC L2SA812RLT1G

ModelL2SA812RLT1G
PackageSOT23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC L2SA812RLT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
L2SA812RLT1G
Electronic Component
1
Package
SOT23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0225969677
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
180MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

L2SA812RLT1G 产品概述

概要

L2SA812RLT1G 是由乐山无线电(LRC)制造的一款高性能三极管(BJT),属于PNP类型。该器件以其出色的电气特性和广泛的应用场景而受到广泛欢迎,特别是在需要高可靠性和高性能的电子系统中。

基础参数

  • 功率(Pd): 200 mW
    • 这表明该三极管在正常工作条件下可以承受的最大功率,确保在设计时不会超过此阈值,从而避免过热和损坏。
  • 商品分类: 三极管(BJT)
    • 作为一种基本的电子器件,三极管广泛用于放大、开关和信号处理等应用。
  • 工作温度: -55℃ ~ +150℃
    • 宽泛的工作温度范围使得 L2SA812RLT1G 适用于各种环境条件下的应用,从极寒到高温环境。
  • 晶体管类型: PNP
    • PNP 三极管在电路设计中常用于负载驱动、信号放大和逻辑门等场景。
  • 特征频率(fT): 180 MHz
    • 高特征频率指示该三极管能够处理高频信号,这使其特别适合于射频(RF)和高频电子系统。
  • 直流电流增益(hFE@Ic,Vce): 120 @ 1 mA, 6.0 V
    • 直流电流增益是衡量三极管放大能力的一个重要指标。该值表明在指定条件下,基极输入电流可以被放大到120倍。
  • 集射极击穿电压(Vceo): 50 V
    • 集射极击穿电压是指在基极短路情况下,集电极与发射极之间允许的最大电压。这确保了器件在正常操作范围内不会因过压而损坏。
  • 集电极-发射极饱和电压(VCE(sat)@Ic,Ib): 180 mV @ 100 mA, 10 mA
    • 饱和电压是指当三极管完全导通时,集电极与发射极之间的最小电压。低饱和电压意味着更低的能耗和更高的效率。
  • 集电极截止电流(Icbo): 100 nA
    • 集电极截止电流表示当基极无输入信号时,集电极流过的微小电流。这对于确保静态电流消耗最小化非常重要。
  • 集电极电流(Ic): 150 mA
    • 最大允许集电极电流是设计电路时的一个关键参数,确保不超过此值以避免过载和损坏。

封装和品牌

  • 封装: SOT-23
    • SOT-23 封装是一种小型化封装,适合于空间有限但要求高性能的应用场景。
  • 品牌: 乐山无线电(LRC)
    • 乐山无线电是一家具有丰富经验和良好声誉的电子元器件制造商,产品广泛应用于各个行业。

应用场景

L2SA812RLT1G 因其优异的性能和可靠性,适用于多种应用场景:

  • 信号放大: 由于其高直流电流增益和高特征频率,L2SA812RLT1G 非常适合用于音频和视频信号放大。
  • 开关电路: 低饱和电压和高集电极电流使其成为理想的开关元件,用于驱动负载或控制其他电子设备。
  • 逻辑门和数字电路: 在数字电子系统中,L2SA812RLT1G 可以作为逻辑门或缓冲器使用。
  • 射频(RF)应用: 高特征频率使得该器件也可以用于RF放大和处理。

设计考虑

在使用 L2SA812RLT1G 时,以下几点需要特别注意:

  • 热管理: 尽管该器件有200 mW的功率等级,但在高负载或高频操作下仍需要适当的散热措施。
  • 过压保护: 确保电路设计中不超过集射极击穿电压,以防止器件损坏。
  • 基极驱动: 由于直流电流增益较高,需要确保基极输入信号合适,以避免过度饱和或截止。

总之,L2SA812RLT1G 是一款高性能、多功能的PNP三极管,广泛适用于各种电子系统和应用场景。其优异的电气特性、宽泛的工作温度范围以及小型化封装,使其成为许多工程师和设计师的首选器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.