WMSIC Electronic Components

LRC LM3Z7V5T1G

ModelLM3Z7V5T1G
PackageSOD-323
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LM3Z7V5T1G
Type
LRC
Minimum package
3000

Technical parameters

Electronic Component
LRC
Electronic Component
LM3Z7V5T1G
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzk)
160Ω
(Zzt)
15Ω
Electronic Component
BM0230025583
Diode
1
Current(Ir)
500nA@1V
Power Dissipation(Pd)
200mW
Electronic Component
7V~7.9V
Electronic Component
65℃~+150℃
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM3Z7V5T1G 产品概述

一、产品简介

LM3Z7V5T1G 是一款来自 LRC(乐山无线电)的独立式稳压二极管,标称稳压值为 7.5V,实际稳压范围为 7.0V ~ 7.9V。该器件采用 SOD-323 微型封装,面向空间受限的表面贴装应用,适用于微功率精密稳压与过压钳位场合。

二、主要参数

  • 稳压值(标称):7.5V
  • 稳压值范围:7.0V ~ 7.9V
  • 最大耗散功率 Pd:200 mW
  • 反向电流 Ir:500 nA @ 1 V(典型低漏电)
  • 稳态阻抗 Zzt:15 Ω(测量条件下)
  • 小电流阻抗 Zzk:160 Ω
  • 工作结温范围:-65 ℃ ~ +150 ℃
  • 封装:SOD-323(表面贴装)
  • 类型:独立式稳压二极管

三、特性与电气行为

LM3Z7V5T1G 在规定测试电流下能提供稳定的 7.5V 参考电压,低反向漏电(500 nA@1V)有助于在待机或低电流环境中维持稳定输出。Zzt 值较低,表示在工作电流范围内动态阻抗小,电压稳定性较好;Zzk 较高,表明在极低电流区间稳压特性会变差,应避免长期工作于微安级以下的条件。器件最大耗散 200 mW,需在实际应用中注意功率热管理与必要的降额。

四、应用建议

  • 精密电源参考与基准源(中低功耗场合)
  • 电压钳位与浪涌保护(配合限流电阻)
  • 通信与便携设备的局部稳压与保护电路
  • 仪表和传感器接口的过压保护

五、封装与安装注意

SOD-323 为小型表面贴装封装,适合高密度 PCB 布局。由于封装体积小,散热能力有限,建议通过拓展铜箔面积或靠近散热层的布线来改善热散逸。设计时应计算器件在最大工作电流下的功耗并留有充分热裕量,避免结温超过 +150 ℃。焊接时遵循回流曲线,避免长时间高温暴露导致性能退化。

六、可靠性与选型要点

在选型和布局时注意:若电路中可能出现较大反向电压或持续较高电流,需严格控制通过二极管的电流以免超过 200 mW 的耗散上限;对温度敏感的应用应考虑热降额;当电路要求更低的稳压容差或更高功率时,建议选择功率更高或温度系数更好的替代件。

七、订购信息

型号:LM3Z7V5T1G
品牌:LRC(乐山无线电)
封装:SOD-323
在采购前请核对生产厂家的最新数据手册以确认测试条件与典型曲线,并根据实际应用进行热设计与老化验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.