WMSIC Electronic Components

LRC L2SC4617RT1G

ModelL2SC4617RT1G
PackageSC-89
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC L2SC4617RT1G
Type
LRC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
L2SC4617RT1G
Electronic Component
1
Package
SC-89
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.026g
Electronic Component
1
Electronic Component
BM0264382392
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
180MHz
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

L2SC4617RT1G(NPN型BJT)产品概述

L2SC4617RT1G是乐山无线电(LRC)推出的一款NPN型双极结型晶体管(BJT),定位于中低压、小电流场景下的信号放大与低速开关应用,凭借稳定的电性能、宽温适应性及紧凑封装,成为消费电子、工业控制等领域的实用选型。

一、基本身份与核心定位

该晶体管属于小信号中功率BJT范畴——既具备高频小信号放大能力,又能承受150mA集电极电流与50V集射极耐压,覆盖了多数普通电子电路的核心需求。其品牌为国内半导体行业知名厂商LRC,产品一致性与可靠性经过长期市场验证,适合批量应用于各类电子设备。

二、关键电性能参数解析

参数是晶体管应用的核心依据,L2SC4617RT1G的关键性能参数可满足多场景需求:

1. 耐压与电流承载能力

  • 集射极击穿电压(VCEO):50V:满足中低压电路(如12V/24V系统)的耐压要求,避免过压击穿;
  • 最大集电极电流(IC):150mA:可驱动小型负载(如LED、微型继电器),同时满足信号放大的电流需求;
  • 最大耗散功率(Pd):150mW:在连续工作时需注意散热,但小信号场景下无需额外散热设计。

2. 增益与频率特性

  • 直流电流增益(hFE):120@1mA、6V:在典型小信号工作点(1mA集电极电流、6V集射极电压)下增益稳定,无需复杂的增益补偿电路;
  • 特征频率(fT):180MHz:支持高频小信号放大(如FM收音机、对讲机的前置放大),避免信号失真。

3. 开关与截止特性

  • 集射极饱和电压(VCE(sat)):500mV@50mA、5mA:饱和压降低,开关导通损耗小,适合低速开关应用(如LED闪烁控制);
  • 集电极截止电流(ICBO):100nA:截止状态下漏电流极小,提升电路的静态功耗控制能力,尤其适合低功耗设备。

4. 反向耐压保护

  • 射基极击穿电压(VEBO):7V:避免射极与基极反向偏置时的击穿风险,增强电路可靠性。

三、封装与环境适应性

1. 紧凑封装设计

采用SC-89表面贴装封装(对应SOT-23封装形式),体积小巧(约2.9×1.6×1.1mm),适合高密度PCB布局,减少设备体积与重量,符合消费电子小型化趋势。

2. 宽温工作范围

工作温度覆盖**-55℃~+150℃**,满足工业级环境(如户外设备、车载辅助电路)的温度需求,无需额外温控设计,提升设备在极端环境下的稳定性。

四、典型应用场景

L2SC4617RT1G的性能匹配多类电子电路,典型应用包括:

  1. 高频小信号放大:FM收音机、蓝牙模块、对讲机的前置放大电路,利用180MHz特征频率实现清晰信号放大;
  2. 低速开关控制:LED指示灯驱动、微型继电器控制、小型电磁阀驱动,低饱和压降降低导通损耗;
  3. 传感器信号放大:温度传感器、压力传感器的输出信号放大,小漏电流避免信号失真;
  4. 小功率稳压调整:简易稳压电路的调整管,满足12V/24V小功率电源的稳压需求。

五、品牌与品质保障

乐山无线电(LRC)作为国内老牌半导体厂商,拥有数十年晶体管研发生产经验,L2SC4617RT1G符合RoHS环保标准,产品一致性好(hFE偏差小),可靠性经过批量验证,适合家电、工业控制、通信等领域的量产应用。

总结:L2SC4617RT1G是一款性能均衡的NPN型BJT,在小信号放大、低速开关场景下表现稳定,宽温与紧凑封装使其适配多类设备,是电子工程师的实用选型之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.