WMSIC Electronic Components

LRC LDTC114YET1G

ModelLDTC114YET1G
PackageSC-89
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LDTC114YET1G
Type
LRC
Minimum package
4000

Technical parameters

Electronic Component
LRC
Electronic Component
LDTC114YET1G
Electronic Component
1
Package
SC-89
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0264340193
Operating Temperature
55℃~+150℃
Resistor
0.21
Resistor
10kΩ
Transistor Type
NPN
Power Dissipation(Pd)
200mW
Electronic Component
4000
Collector Current(Ic)
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LDTC114YET1G产品概述

LDTC114YET1G是乐山无线电(LRC)推出的一款预偏置NPN型数字晶体管,专为小信号放大、低功耗开关及数字逻辑电路设计,采用紧凑的SC-89表面贴装封装,兼具高可靠性与易集成性,适用于多种工业及消费电子场景。

一、产品基本信息

  • 品牌:乐山无线电(LRC),国内半导体行业知名厂商,专注功率器件与数字晶体管研发生产超数十年;
  • 产品类型:预偏置NPN数字晶体管(内部集成偏置电阻,无需外部额外配置偏置电路);
  • 封装形式:SC-89小型表面贴装封装,体积紧凑,适配高密度PCB布局;
  • 核心定位:替代传统离散NPN+偏置电阻方案,简化电路设计、降低成本的通用小信号器件。

二、核心电气参数详解

LDTC114YET1G的关键参数经过优化,精准匹配小信号应用需求:

  1. 耐压能力:集射极击穿电压(Vceo)为50V,满足多数低压电路的耐压要求,避免过压损坏风险;
  2. 电流规格:最大集电极电流(Ic)100mA,适合小电流信号放大与开关控制(如LED驱动、传感器信号处理);
  3. 功耗限制:最大耗散功率(Pd)200mW,低功耗设计适配电池供电或低功耗系统;
  4. 电流增益:直流电流增益(hFE)在Vce=10V、Ic=5mA条件下稳定在80,增益一致性好,无需频繁调试;
  5. 饱和压降:集射极饱和压降(VO(on))仅200mV,开关状态下损耗极低,显著提升电路效率;
  6. 预偏置电阻:内部集成输入电阻10kΩ、电阻比率0.21,彻底简化电路设计(无需外部偏置电阻),减少元件数量与PCB空间占用。

三、典型应用场景

凭借小体积、低功耗与预偏置设计,LDTC114YET1G广泛覆盖以下场景:

  1. 数字逻辑电路:作为逻辑门、缓冲器的驱动元件,适配MCU/微处理器IO口控制,实现信号放大与电平匹配;
  2. 小信号开关:低功耗开关电路(如按键信号放大、状态检测),或100mA以内小型继电器的驱动;
  3. LED驱动:小功率LED(指示灯、背光)的限流驱动,结合低饱和压降降低发热,延长LED寿命;
  4. 传感器信号处理:温度、压力等模拟传感器的信号放大,提升信号强度与稳定性,便于后续采集;
  5. 消费电子与工业控制:智能家居设备、小型仪器仪表、工业传感器节点等低功耗、小型化场景。

四、封装与可靠性特点

  1. SC-89封装优势:
    • 小型表面贴装设计,尺寸紧凑(参考LRC官方 datasheet),适配高密度PCB布局;
    • 表面贴装工艺兼容自动化生产,降低组装成本与人工误差;
  2. 宽温工作范围:
    • 工作温度覆盖-55℃~+150℃,适应极端环境(如工业现场、户外设备);
    • 高温下仍保持稳定的电气性能,可靠性经高低温循环、湿度测试等验证;
  3. 抗干扰能力:内部集成电阻的预偏置设计,减少外部干扰对偏置电路的影响,提升电路稳定性。

五、产品优势总结

  1. 简化设计:预偏置集成设计,无需外部偏置电阻,直接替换离散方案,缩短研发周期;
  2. 高效节能:低饱和压降(200mV)与低功耗(200mW),适合电池供电或对功耗敏感的系统;
  3. 高一致性:电流增益(hFE=80@5mA/10V)稳定,批量应用时性能一致,减少调试成本;
  4. 宽温适配:-55℃~+150℃宽温范围,覆盖工业、消费电子多场景需求;
  5. 小体积集成:SC-89封装节省PCB空间,适配智能手机、可穿戴设备等小型化产品。

LDTC114YET1G作为一款高性价比的预偏置NPN数字晶体管,以其稳定的性能、紧凑的封装与低功耗设计,成为小信号放大与开关应用的理想选择,可有效提升电路设计效率与系统可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.