WMSIC Electronic Components

LRC L2SA1037AKRLT1G

ModelL2SA1037AKRLT1G
PackageSOT-23(SOT-23-3)
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC L2SA1037AKRLT1G
Type
LRC
Minimum package
3000

Technical parameters

Electronic Component
LRC
Electronic Component
L2SA1037AKRLT1G
Electronic Component
1
Package
SOT-23(SOT-23-3)
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0229959679
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
140MHz
Power Dissipation(Pd)
200mW
Electronic Component
3000
Collector Current(Ic)
150mA
Current (h FE)
120

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

L2SA1037AKRLT1G 产品概述

一、产品简介

L2SA1037AKRLT1G 是 LRC(乐山无线电)出品的一款小信号 PNP 晶体管,采用 SOT-23(SOT-23-3)封装。器件为低功耗、低噪声的 PNP 双极型晶体管,适合用于小信号放大、开关以及电平移位等场合,特别适用于电池供电和空间受限的便携式电子设备。

二、主要电气参数

  • 晶体管类型:PNP(BJT)
  • 集电极电流 (Ic):最大 150 mA
  • 集-射极击穿电压 (Vceo):50 V
  • 耗散功率 (Pd):200 mW(SOT-23 封装,依 PCB 散热条件)
  • 直流电流增益 (hFE):典型 120(测量条件 Ic=1 mA, Vce=6 V)
  • 特征频率 (fT):约 140 MHz,适合中高频小信号放大与高速开关
  • 集电极截止电流 (Icbo):典型 100 nA
  • 集射极饱和电压 (VCE(sat)):典型 500 mV(测试条件 Ic=50 mA, Ib=5 mA)
  • 射基极击穿电压 (Vebo):6 V
  • 工作温度范围:-55 ℃ ~ +150 ℃

三、性能特性与优势

  • 低压降:VCE(sat) 典型 0.5 V,在 50 mA 开关情况下表现良好,适合低压应用。
  • 高增益:在小电流工作点(Ic≈1 mA)下 hFE 约 120,便于作为前级放大器使用,能减少偏置电流需求。
  • 高频特性:fT 达 140 MHz,支持较高频率下的放大或快速开关响应。
  • 低漏电:Icbo 低至 100 nA,有利于高阻抗输入或节能待机电路。

四、典型应用

  • 便携式电源管理与电平移位(PNP 侧用于高端开关)
  • 小信号放大与前置放大器(音频前级、传感器信号调理)
  • 开关电路与驱动(低至中等电流负载驱动)
  • 高频小信号快速切换(射频前端的某些偏置场合)
  • 通用电子设备中替换或升级低功耗 PNP 晶体管

五、封装与装配注意事项

  • 封装:SOT-23,适合表面贴装 SMT 生产线。
  • PCB 设计建议:为保证 200 mW 的耗散能力,应优化散热铜箔面积,尽量在集电极焊盘处加大敷铜并使用多层过孔导热。
  • 引脚说明:常见 SOT-23 引脚排列在不同厂家的封装定义可能有差异,布线与焊盘设计应以官方数据手册为准。
  • 储运与防静电:为防止损伤,生产与装配过程中应采取 ESD 保护措施;长期储存建议保持干燥、避免潮湿环境。

六、选型与替代建议

L2SA1037AKRLT1G 定位于低功耗中压 PNP 小信号场合。选型时应根据工作电流、功耗余量及频率需求匹配器件参数;若需更高功率或更大电流,应选择功耗/封装更高的替代型号;若关心更低 VCE(sat) 或更大 hFE,可对比其他同等级 PNP 晶体管的数据手册以获得最佳方案。

七、包装与订购

  • 封装形式适合自动贴片生产线(卷带供货)。
  • 具体包装数、最小订购量与运输信息,请参阅乐山无线电(LRC)官方资料或向授权分销商咨询。

如需器件的详细电参数曲线、引脚排列图或推荐的典型应用电路,请提供需求,我可进一步整理基于官方数据手册的完整参考资料。

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