WMSIC Electronic Components

LRC S-LMBT5551LT1G

ModelS-LMBT5551LT1G
PackageSOT-23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-LMBT5551LT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
S-LMBT5551LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0229962913
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
600mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S-LMBT5551LT1G 产品概述

一、产品简介

S-LMBT5551LT1G 是一款高压小信号 NPN 三极管,来自 LRC(乐山无线电),采用 SOT-23 封装。器件具有较高的集电极击穿电压和适中的电流承受能力,适合在高压开关、信号放大及保护电路中作为通用高压开关元件使用。

二、主要参数

  • 晶体管类型:NPN
  • 集电极电流 Ic:最大 600 mA(脉冲条件下应参考数据手册)
  • 集—射击穿电压 Vceo:160 V
  • 耗散功率 Pd:常见资料标注约 300 mW(亦有部分资料标注 225 mW,实际可用功率依封装散热条件与测试环境而异)
  • 直流电流增益 hFE:约 80(测试条件 Ic=1.0 mA,Vce=5.0 V)
  • 集电极截止电流 Icbo:典型 50 nA
  • 集电极饱和电压 VCE(sat):约 200 mV(示例测试条件 IC=50 mA,IB=5 mA)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 基-发击穿电压 Vebo:6 V

三、特性与优势

  • 高 Vceo(160 V),适合高压侧的小信号开关与放大场合。
  • 低漏电流(Icbo≈50 nA),在高阻态和微弱信号场合噪声贡献小。
  • 在低至中等电流工作点有良好增益(hFE≈80),便于作为前级放大或驱动级。
  • SOT-23 小封装利于表贴自动化生产,适配便携和空间受限的设计。

四、典型应用

  • 开关电源及高压偏置电路的高压开关或保护元件。
  • 显示器、电源模块中的高压驱动/切换。
  • 通用小信号放大(高压耐压场合)。
  • 过流检测和保护电路(需注意热耗散与脉冲限流)。

五、封装与引脚(示例)

  • 封装:SOT-23(表面贴装)
  • 常见引脚定义(请以具体数据手册为准):
    • Pin1:Base(基极)
    • Pin2:Emitter(发射极)
    • Pin3:Collector(集电极)

六、使用与热管理注意事项

  • 避免对基-发极施加超过 Vebo=6 V 的反向电压,以防损坏。
  • 虽然 Ic 标称可达 600 mA,但 SOT-23 封装下连续大电流受限于散热能力,应通过增加 PCB 铜面积或散热层、限制占空比或采用脉冲工作以保障可靠性。
  • 器件功耗须随环境温度降额使用,设计时按实际 PCB 热阻并参考厂商数据手册确定最大稳态功耗。
  • 饱和区驱动时注意基极电流与功耗的平衡,避免长期在高饱和度下工作导致过热。

以上为 S-LMBT5551LT1G 的概述与使用建议,具体电气特性、极限值及波特测试条件请以 LRC 提供的正式数据手册为准。

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