WMSIC Electronic Components

LRC LUDZS5.6BT1G

ModelLUDZS5.6BT1G
PackageSOD-323
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LUDZS5.6BT1G
Type
LRC
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LUDZS5.6BT1G
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzk)
200Ω
(Zzt)
60Ω
Electronic Component
BM0230029590
Diode
1
Power Dissipation(Pd)
200mW
Electronic Component
5.49V~5.73V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LUDZS5.6BT1G 产品概述

一、产品简介

LUDZS5.6BT1G 是乐山无线电(LRC)生产的一款独立式稳压二极管(稳压值标称 5.6V),采用 SOD-323 小封装,适合空间受限的便携与终端电路。器件提供稳定的基准电压和过压钳位功能,适用于低功耗稳压、参考源与浪涌保护场合。

二、主要电气参数

  • 稳压值(标称):5.6V;范围:5.49V ~ 5.73V
  • 反向电流 Ir:1 μA @ 2.5V
  • 最大耗散功率 Pd:200 mW(器件级别,受封装与环境温度影响需热设计)
  • 稳态阻抗 Zzt:60 Ω;拐点阻抗 Zzk:200 Ω
  • 配置:独立式(分立二极管)

三、产品特点

  • 小体积封装 SOD-323,适合表面贴装与高密度布局
  • 稳压精度好(标称 5.6V,实际范围窄)
  • 低反向漏流(1 μ[email protected]),适合低电流参考应用
  • 适用于瞬态钳位与轻载稳压场景

四、设计与热管理建议

  • 理论最大稳压电流 Iz_max = Pd / Vz = 200 mW / 5.6 V ≈ 35.7 mA。考虑封装散热和可靠性,建议长期工作电流采用额定值的 50%70%,即持续工作时 Iz ≤ 2025 mA。
  • SOD-323 封装散热能力有限,若在高环境温度或长期大电流使用,应采取降额或改用散热更好的封装/外部散热措施。
  • 稳压二极管为并联(分流)工作:设计时须保证在最大负载条件下有足够分流电流维持在稳压区。稳压电阻与输入电压、负载电流共同决定工作点。

五、典型计算示例

假设 VIN = 12 V,需要在负载 Iload = 1 mA 下获得 5.6 V 输出,取参考稳压电流 Iz = 5 mA(保证稳压余量),则总通过电阻电流 I = Iz + Iload = 6 mA,电阻 R = (VIN - VZ) / I = (12 - 5.6) / 6 mA ≈ 1.07 kΩ,取 1 kΩ 标准值。实际设计应验证器件在该 Iz 下的 VZ 变化与功耗。

六、典型应用场景

  • 小功率基准电源与低压差稳压
  • 电路保护:过压钳位与浪涌吸收(瞬态)
  • 便携设备、传感器前端和通信模块的参考电压源
  • 替代精密参考时需注意温漂与负载响应

七、封装与订购注意

  • 封装:SOD-323,适合自动贴装生产
  • 品牌:LRC(乐山无线电)
  • 型号:LUDZS5.6BT1G。批量采购与具体可靠性/温漂数据,请参考厂商完整数据手册并与供应商确认样片测试。

八、使用要点

  • 在高温或高流条件下进行热仿真与实测,避免超过 Pd 限值。
  • 对于要求更低噪声或更精准温漂的场合,应选用专用参考源;稳压二极管适合成本/面积优先且电流要求较小的场景。
  • 设计前请查阅完整数据表以获取测试条件(测试电流、温度系数、最大极限等)并据此优化电路。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.