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LRC RS3MB
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC RS3MB
- Type
- LRC
- Minimum package
- 3500
Technical parameters
- Electronic Component
- LRC
- Electronic Component
- RS3MB
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.183g
- Electronic Component
- 1
- Electronic Component
- BM0258849717
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 5uA@1kV
- (Vf)
- 1.3V@3A
- Electronic Component
- 50℃~+150℃
- Electronic Component
- 3500
- Voltage Rating(Vr)
- 1kV
- Surge Current (Ifsm)
- 80A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RS3MB 通用整流二极管 产品概述
一、规格概述
RS3MB 是乐山无线电（LRC）出品的一款通用整流二极管，采用 SMB（DO-214AA）表面贴装封装，适用于中小功率整流场合。主要电气参数如下：
- 正向压降 Vf：1.3V @ 3A
- 直流反向耐压 Vr：1000V
- 平均整流电流：3A
- 反向漏电流 Ir：5µA @ 1kV
- 非重复峰值浪涌电流 Ifsm：80A
- 工作结温范围：-50℃ ~ +150℃
二、主要特性与优势
- 高耐压：1000V 反向耐压适合高压整流与耐压严苛的应用场景。
- 低漏电：5µA（@1kV）保证在高压条件下的较小静态损耗，有利于高阻态下的可靠性。
- 强浪涌承受能力：80A 峰值浪涌电流可承受启动或短时冲击电流。
- 宽温区：-50℃ 到 +150℃ 的工作结温适合工业级和恶劣环境使用。
- SMB 封装利于自动贴片与波峰/回流焊工艺。
三、典型应用场景
- 开关电源整流与次级整流
- 工业电源、高压电源与逆变器的整流元件
- 充电器、适配器中的高压整流或保护
- 电机驱动、照明电源的自由轮整流与续流环节
四、封装与热管理建议
SMB 表面贴装封装要求合理的 PCB 散热设计。建议：
- 在二极管焊盘周围增加铜面或热沉通孔以提高散热能力。
- 在连续 3A 工作点时考虑导热路径与周边元件的热耦合，必要时采用散热片或加大铜厚。
- 在高频脉冲或浪涌工况下，评估结温上升并做适当的电流/功率降额设计。
五、选型与使用注意
- 反向电压裕量：实际电路工作电压应留有安全裕量，避免长期接近 1000V 导致漏电或击穿风险。
- 温度影响：反向漏电随温度上升会增加，热设计对可靠性至关重要。
- 焊接工艺：遵循 SMB 封装的回流焊温度曲线，避免过高温度与过长焊接时间以保护器件可靠性。
- 浪涌保护：Ifsm 为非重复峰值，设计时不可将其作为长期过载标准，应配合保险或限流器件防止重复冲击。
如需更详细的参数曲线（正向特性、反向特性随温度的变化、封装尺寸和回流曲线），建议向供应商索取 RS3MB 的完整数据手册以做最终设计验证。
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