WMSIC Electronic Components

LRC S-L2N7002SLT1G

ModelS-L2N7002SLT1G
PackageSOT-23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-L2N7002SLT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
S-L2N7002SLT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0227566479
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
35pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S-L2N7002SLT1G 产品概述

1. 产品简介

S-L2N7002SLT1G 是一款由乐山无线电(LRC)生产的 N 沟道场效应管(MOSFET),采用 SOT-23 封装。该器件设计用于低功率应用,具有优异的开关性能和较低的导通电阻,适用于各种电子电路中的开关和放大功能。

2. 关键特性

  • 功率 (Pd): 300mW
  • 漏源电压 (Vdss): 60V
  • 连续漏极电流 (Id): 380mA
  • 导通电阻 (RDS(on)): 2.8Ω @ 10V, 500mA
  • 栅极电荷 (Qg): 440pC @ 4.5V
  • 输入电容 (Ciss): 35pF @ 25V
  • 反向传输电容 (Crss): 5pF @ 25V
  • 阈值电压 (Vgs(th)): 2V @ 250uA
  • 工作温度范围: -55℃ ~ +150℃ (Tj)

3. 应用领域

S-L2N7002SLT1G 适用于多种低功率电子应用,包括但不限于:

  • 电源管理: 用于 DC-DC 转换器、电池保护电路等。
  • 信号开关: 在模拟和数字电路中作为信号开关使用。
  • 放大电路: 用于低功率放大电路,如音频放大器。
  • 逻辑电平转换: 用于不同逻辑电平之间的转换。

4. 性能优势

  • 低导通电阻: 2.8Ω 的导通电阻确保了在低电压下的高效能转换,减少了功率损耗。
  • 高开关速度: 低栅极电荷和输入电容使得器件具有快速的开关速度,适用于高频应用。
  • 宽工作温度范围: 能够在 -55℃ 至 +150℃ 的温度范围内稳定工作,适应各种环境条件。
  • 小封装: SOT-23 封装使得器件在空间受限的应用中具有优势。

5. 设计考虑

  • 驱动电压: 确保栅极驱动电压在推荐范围内(通常为 4.5V 至 10V)以获得最佳性能。
  • 散热管理: 虽然功率较低,但在高密度电路板设计中仍需考虑适当的散热措施。
  • 静电防护: MOSFET 对静电敏感,建议在操作和存储过程中采取适当的防静电措施。

6. 典型应用电路

以下是一个简单的开关电路示例,展示了 S-L2N7002SLT1G 的典型应用:

+5V | | [R1] 10kΩ | | Gate ---+ | [S-L2N7002SLT1G] | | Load ---+ | GND

在这个电路中,S-L2N7002SLT1G 作为开关控制负载的通断。当栅极电压高于阈值电压时,MOSFET 导通,负载通电;当栅极电压低于阈值电压时,MOSFET 截止,负载断电。

7. 结论

S-L2N7002SLT1G 是一款性能优异、应用广泛的 N 沟道 MOSFET,适用于多种低功率电子应用。其低导通电阻、高开关速度和宽工作温度范围使其成为设计工程师的理想选择。无论是在电源管理、信号开关还是放大电路中,S-L2N7002SLT1G 都能提供稳定可靠的性能。

通过合理的设计和应用,S-L2N7002SLT1G 能够显著提升电路的效率和可靠性,满足现代电子设备对高性能元器件的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.