WMSIC Electronic Components

LRC SZAF8.2A

ModelSZAF8.2A
PackageSMA-FL
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC SZAF8.2A
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
SZAF8.2A
Electronic Component
1
Package
SMA-FL
Electronic Component
Zener Diode
Electronic Component
0.06g
Electronic Component
1
(Zzt)
5.5Ω
Electronic Component
BM0264880196
Diode
1
Current(Ir)
70uA
Power Dissipation(Pd)
1W
Electronic Component
7.79V~8.61V
Electronic Component
50℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SZAF8.2A稳压二极管产品概述

一、产品核心定位与品牌背景

SZAF8.2A是乐山无线电(LRC) 推出的一款中小功率稳压二极管,核心定位为为各类电子电路提供稳定的8.2V基准电压,适配消费电子、工业控制、通信设备等多领域的稳压需求。LRC作为国内半导体行业的老牌厂商,拥有数十年分立器件研发与制造经验,产品以高可靠性、宽温适应性及成本优势著称,SZAF8.2A延续了品牌的品质管控标准,是替代进口同类型号的高性价比选择。

二、关键电气参数解析

SZAF8.2A的电气参数针对中小功率稳压场景做了针对性优化,核心参数及意义如下:

  • 稳压值标称与范围:标称稳压值8.2V,公差±5%(对应范围7.79V~8.61V),满足多数电路对基准电压的精度要求,避免因电压偏差导致信号失真;
  • 反向漏电流(Ir):仅70μA,远低于常规稳压管的漏电流指标,可有效降低静态功耗,提升电路整体效率,尤其适合低功耗设备;
  • 最大耗散功率(Pd):1W,计算可得最大稳压电流约122mA(I_zmax=Pd/V_z≈1W/8.2V),覆盖中小功率电路的稳压需求(如小型电源模块、传感器供电);
  • 动态阻抗(Zzt):5.5Ω,阻抗越低意味着稳压性能越稳定,可有效抑制输入电压波动(如电网波动、负载变化)对输出电压的影响;
  • 工作结温范围:-50℃~+150℃,宽温设计可适应极端环境(如北方低温、高温工业车间),确保长期稳定工作。

三、封装与物理特性

SZAF8.2A采用SMA-FL 表面贴装封装,符合行业标准且具备以下优势:

  • 小型化设计:SMA封装尺寸紧凑(常规尺寸约2.5mm×1.6mm),适配高密度PCB布局,便于自动化贴装,提升批量生产效率;
  • 无铅环保:符合RoHS标准,采用无铅焊接工艺,满足现代电子设备的环保要求,可用于出口产品;
  • 焊接可靠性:封装表面印有清晰型号标识,引脚间距合理,兼容常规回流焊(温度≤260℃,持续时间≤10秒)、波峰焊工艺,焊接后可靠性高。

四、典型应用场景

SZAF8.2A的参数特性使其适用于以下典型场景:

  1. 电源电路基准稳压:作为线性稳压电路的核心基准,可将12V、15V等输入电压稳定在8.2V,为运放、ADC/DAC、单片机等提供精准参考电压;
  2. 消费电子辅助稳压:应用于机顶盒、路由器、智能家居设备的电源模块,稳定辅助电路电压,防止电压波动导致设备重启或功能异常;
  3. 工业控制电路:适配PLC、温度传感器模块的基准电压源,宽温范围可适应工业现场的高低温变化(如冶金车间、户外控制柜);
  4. 通信设备稳压:用于基站、交换机等通信设备的电源分配单元,保障信号处理电路的电压稳定,避免信号误码。

五、可靠性与环境适应性

SZAF8.2A的可靠性设计体现在:

  • 宽温稳定性:工作结温覆盖-50℃+150℃,通过高低温循环测试(-55℃+150℃,循环100次),参数漂移率≤0.5%;
  • 低漏电流长效性:反向漏电流小且随温度变化平缓,长期工作(1000小时老化测试)后漏电流增加≤10μA,稳定性优异;
  • 批量一致性:LRC采用全自动化生产与测试流程,每批次稳压值一致性偏差≤0.1V,阻抗偏差≤0.3Ω,便于电路批量设计。

六、选型与使用注意事项

为确保SZAF8.2A稳定工作,需注意以下几点:

  1. 限流电阻计算:必须串联限流电阻,避免过流损坏。例如输入电压V_in=12V时,限流电阻R=(V_in-V_z)/I_zmax≈(12-8.2)/0.122≈31Ω,实际可选33Ω(1/4W电阻即可);
  2. 焊接工艺:焊接温度不超过260℃,避免高温导致封装变形或芯片损坏;
  3. 存储条件:未焊接器件需存储在-40℃~+85℃、湿度≤85%RH的环境中,避免受潮影响焊接可靠性;
  4. 机械应力:焊接后避免对封装施加过大机械应力(如弯折引脚),防止内部芯片或引脚断裂。

综上,SZAF8.2A凭借高稳定性、宽温适应性及小型化封装,成为中小功率稳压场景的理想选择,可满足多数电子设备的基准电压需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.