Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S-LBZT52C10T1G是乐山无线电(LRC)推出的表面贴装稳压二极管,核心功能为提供稳定的10V基准电压,属于LRC LBZT52系列稳压管的一员。该器件采用紧凑的SOD-123封装,适配小型化、低功耗电子设备的电路设计需求,继承了系列产品高可靠性、宽温适应性的特点,广泛应用于电源稳压、过压保护等场景。
标称稳压值为10V,稳压范围覆盖9.4V~10.6V,满足多数通用电路对稳压精度的需求;动态阻抗Zzt(测试电流下的稳压阻抗)仅20Ω,说明工作电流变化时稳压值波动极小,可稳定输出基准电压;拐点阻抗Zzk=150Ω,确保低电流状态下仍能快速进入稳压区,响应速度快。
最大耗散功率Pd为500mW,支持小功率电路稳压需求;反向漏电流Ir仅200nA,反向偏置时几乎无额外损耗,特别适合电池供电的低功耗设备,有效延长续航时间。
工作结温覆盖**-55℃~+150℃**,远超常规民用器件的温度耐受能力,可适应工业控制、汽车电子、户外设备等恶劣环境下的长期稳定工作,可靠性得到保障。
采用SOD-123表面贴装封装,典型尺寸约1.6mm×0.8mm×0.6mm,占用PCB面积极小,适合高密度电路布局;封装材料耐高温、抗腐蚀,配合LRC成熟的半导体工艺,确保焊接与使用过程中性能稳定,无封装失效风险。
可作为小功率直流电源的输出稳压元件,例如5V/12V电源的辅助稳压,或低电流电路的基准电压源,为MCU、传感器等模块提供稳定的10V工作电压。
与限流电阻、TVS管配合,实现电路过压防护:输入电压异常升高时,稳压管击穿导通,将电压钳位在10V左右,避免后端敏感元件损坏(如智能穿戴充电保护、传感器模块电压防护)。
宽温特性使其适配工业控制器信号稳压、汽车仪表盘辅助电源稳压等场景,适应高低温交替的工作环境。
SOD-123封装适合智能手表、蓝牙耳机、微型传感器等小型化设备,在有限空间内实现稳压功能,不影响设备整体体积。
需计算串联限流电阻阻值,确保实际功耗不超过500mW(例:若稳压值10V、负载电流10mA,串联电阻需满足(R_s \geq \frac{V_{in}-V_z}{I_{z_{max}}}),避免过流损坏)。
极端温度下(-55℃/150℃)稳压值有轻微漂移(约0.05%/℃),高精度场景需增加温度补偿元件。
遵循回流焊规范(峰值240℃~250℃,时间≤10s),避免高温损坏;焊接后检查引脚虚焊,确保电气连接可靠。
LRC S-LBZT52C10T1G稳压二极管凭借精准稳压、低漏电流、宽温范围与紧凑封装,成为小型化电子设备、工业控制、汽车电子等领域的理想稳压元件,兼顾性能与可靠性,可满足多数通用稳压场景需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products