WMSIC Electronic Components

LRC LUDZS9.1BT1G

ModelLUDZS9.1BT1G
PackageSOD-323
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LUDZS9.1BT1G
Type
LRC
Minimum package
3000

Technical parameters

Electronic Component
LRC
Electronic Component
LUDZS9.1BT1G
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzk)
60Ω
(Zzt)
30Ω
Electronic Component
BM0265148846
Diode
1
Current(Ir)
500nA
Power Dissipation(Pd)
200mW
Electronic Component
8.85V~9.23V
Electronic Component
55℃~+150℃
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LUDZS9.1BT1G稳压二极管产品概述

一、产品基本定位与核心功能

LUDZS9.1BT1G是乐山无线电(LRC)推出的独立式稳压二极管,属于小型化表面贴装器件。其核心功能是通过反向击穿特性稳定输出9.1V标称电压,为电子电路提供精准的直流稳压参考,适配对体积、功耗有严格要求的应用场景。

二、关键电气参数详解

该产品的电气性能围绕稳压核心需求设计,关键参数如下:

  1. 稳压值特性:标称稳压值为9.1V,稳压范围覆盖8.85V~9.23V,满足不同电路对稳压精度的基本需求,无需额外校准即可适配多数通用稳压场景;
  2. 反向漏电流:反向电流(Ir)仅500nA,属于低漏电流设计,可有效降低静态功耗,适合对电源效率要求较高的便携设备或低功耗电路;
  3. 功率与阻抗:最大耗散功率(Pd)为200mW,可支撑小功率稳压需求;动态阻抗方面,Zzt(测试电流下的阻抗)为30Ω,Zzk(测试电压下的阻抗)为60Ω,阻抗值稳定,保障稳压输出的线性度;
  4. 宽温工作范围:工作结温覆盖**-55℃~+150℃**,可适应极端环境温度变化,无论是低温户外场景还是高温工作环境,均能保持稳定性能。

三、封装与物理特性

采用SOD-323封装,属于超小型表面贴装封装,尺寸紧凑(典型值为1.6mm×0.8mm×0.6mm),适配高密度PCB布局,适合消费电子、便携设备等对空间有严格限制的产品设计。封装采用表面贴装工艺,可兼容自动化贴装生产线,提升生产效率。

四、典型应用场景

基于产品的小体积、低功耗、宽温特性,LUDZS9.1BT1G的典型应用包括:

  1. 便携电子设备:如智能手机、智能手环、蓝牙耳机等便携产品的电源稳压模块,满足小空间内的稳压需求;
  2. 小型电源电路:如5V转9V或12V转9V的辅助稳压电路,支撑低功率负载的电压稳定;
  3. 传感器电路:为温度、压力等传感器提供稳定的参考电压,保障传感器输出精度;
  4. LED驱动辅助:在小功率LED驱动电路中,辅助稳定输出电压,避免LED亮度波动;
  5. 工业控制单元:适配-55℃~+150℃的宽温环境,用于小型工业控制模块的稳压参考。

五、产品优势与使用注意事项

(1)核心优势

  • 低功耗适配:500nA反向漏电流,显著降低电路静态功耗,适合电池供电设备;
  • 宽温可靠性:覆盖极端温度范围,适应户外、高温等复杂环境;
  • 小体积设计:SOD-323封装可大幅节省PCB空间,提升电路集成度;
  • 品牌可靠性:LRC作为国内知名半导体厂商,产品一致性与稳定性有保障。

(2)使用注意事项

  • 功率限制:实际工作中需确保耗散功率不超过200mW,避免过热损坏;
  • 反向击穿应用:稳压二极管需工作在反向击穿区,使用时需通过限流电阻控制电流,避免过流;
  • 结温控制:工作结温不得超过150℃,需合理设计散热路径(如PCB铜箔布局);
  • 稳压范围适配:根据实际电路需求,确认稳压范围(8.85V~9.23V)是否满足设计要求,避免超出范围使用。

该产品以稳定的稳压性能、紧凑的封装及宽温适应性,成为消费电子、便携设备及小型工业电路的理想稳压解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.