WMSIC Electronic Components

LRC S-LM3Z43VT1G

ModelS-LM3Z43VT1G
PackageSOD-323
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-LM3Z43VT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
S-LM3Z43VT1G
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.024g
Electronic Component
1
(Zzk)
500Ω
(Zzt)
150Ω
Electronic Component
BM0264880191
Diode
1
Power Dissipation(Pd)
200mW
Electronic Component
40V~46V
Electronic Component
65℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S-LM3Z43VT1G稳压二极管产品概述

一、产品核心身份与定位

S-LM3Z43VT1G是乐山无线电(LRC)推出的独立式稳压二极管,属于低功耗、小体积稳压器件系列。该型号针对需要精准稳压、低漏电流及宽温适应的场景设计,广泛适用于便携式电子、工业控制、通信设备等领域的电压调节与基准电压提供,是中小功率稳压电路的高性价比选择。

二、关键电气参数深度解析

该型号的电气参数精准匹配中小功率稳压需求,核心参数如下:

  1. 稳压特性:标称稳压值为43V,实际稳压范围覆盖40V~46V,满足不同电路对稳压值的微调兼容需求;动态阻抗(Zzt)150Ω(测试电流下)、拐点阻抗(Zzk)500Ω(反向击穿前),确保工作电流下稳压输出稳定,波动极小。
  2. 低功耗特性:反向漏电流(Ir)仅50nA(测试条件:30.1V反向电压),大幅降低待机状态下的能量损耗,适合低功耗电路设计;最大耗散功率(Pd)200mW,支撑中小功率场景的稳压需求,避免过功率损坏。
  3. 宽温适应性:工作结温范围覆盖-65℃~+150℃,可稳定工作于极端环境(如工业现场的低温启动、高温持续运行),无需额外温度补偿电路,可靠性更高。

三、封装与物理特性

S-LM3Z43VT1G采用SOD-323表面贴装封装,该封装具备以下优势:

  • 体积小巧:尺寸约1.6mm×0.8mm×0.6mm(典型值),可显著节省PCB布局空间,适合高密度电路设计(如便携式设备、小型模块电源);
  • 贴装便捷:符合标准表面贴装工艺要求,兼容自动化生产,降低装配成本;
  • 可靠性高:封装结构紧凑,抗机械应力能力强,适应振动、冲击等工况,延长产品使用寿命。

四、典型应用场景匹配

结合参数特性,该型号适用于以下场景:

  1. 低功耗便携式设备:如智能手环、蓝牙耳机的辅助稳压电路,低漏电流可延长电池续航;
  2. 工业控制辅助稳压:PLC模块、传感器节点的基准电压提供,宽温范围适应工业现场的温度波动;
  3. 通信设备小信号稳压:路由器、交换机的电源滤波后稳压,确保信号传输稳定;
  4. 小型电源模块:如5V转43V(反向)稳压的小功率电源,200mW功耗满足模块需求,避免发热问题。

五、产品性能优势总结

相较于同类稳压二极管,S-LM3Z43VT1G具备三大核心优势:

  1. 低漏电流+宽温:50nA漏电流与-65℃~+150℃结温范围的组合,在低功耗与极端环境应用中表现突出;
  2. 小体积+高集成:SOD-323封装适配高密度PCB,适合小型化产品设计,满足当前电子设备“轻、薄、小”的趋势;
  3. 稳压精度适配:40V~46V的稳压范围,覆盖了大部分中小功率43V级稳压需求,无需额外选型调整,简化设计流程。

该型号凭借稳定的性能与灵活的适配性,成为中小功率稳压电路的实用选择,可满足多领域的电压调节需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.