Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LDAN202KLT1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LDAN202KLT1G
- Type
- LRC
- Minimum package
- 3000
Technical parameters
- Electronic Component
- LRC
- Electronic Component
- LDAN202KLT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0257686526
- Current
- 100mA
- Diode
- 1
- Current(Ir)
- 100nA
- (Vf)
- 1.2V
- Electronic Component
- 55℃~+150℃@(Tj)
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 80V
- (Trr)
- 4ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LDAN202KLT1G 产品概述
一、产品简介
LDAN202KLT1G 是乐山无线电（LRC）推出的一款小功率开关二极管，采用 SOT-23 小封装，内部为一对共阴极（双二极管共阴极）结构。该器件针对便携式电子、逻辑开关和高频脉冲场景优化，体积小、开关速度快、漏电流低，适合在空间受限且要求开关性能的电路中替代通用开关二极管。
二、主要技术参数
- 配置：1 对共阴极（双二极管）
- 正向压降（Vf）：1.2 V（典型/在指定 If 条件下）
- 直流反向耐压（Vr）：80 V
- 整流电流（If）：100 mA（连续）
- 反向电流（Ir）：100 nA（典型）
- 反向恢复时间（Trr）：4 ns
- 工作结温范围（Tj）：-55 ℃ ~ +150 ℃
- 非重复峰值浪涌电流（Ifsm）：300 mA（瞬态）
- 封装：SOT-23
- 品牌：LRC（乐山无线电）
三、性能特点
- 低漏电：反向电流仅约 100 nA，适合对静态电流敏感的电路。
- 快速开关：4 ns 的反向恢复时间，使其适合高频脉冲与开关用途，在数十 MHz 以内的开关场合表现优异。
- 较高耐压：80 V 的反向耐压可支持中等电压等级的保护与整流应用。
- 小体积低功耗：SOT-23 封装便于高密度 PCB 布局，额定持续正向功率低（在 If=100 mA 时，正向功耗约为 Vf×If ≈ 0.12 W），适合小功率设计。
四、典型应用
- 数字电路的信号整形与方向导通（steering diodes）
- 逻辑电平保护与反接保护电路
- 高频开关、脉冲整流与采样电路
- 低功耗便携设备中的整流/夹位电路
- 小型电源的续流与保护元件
五、封装与焊接建议
- 标准 SOT-23 三引脚封装，节省 PCB 面积；具体引脚排列与封装图请参照器件数据手册。
- 推荐采用标准回流焊工艺进行贴装，遵循无铅或含铅回流曲线规范，注意避免长时间高温暴露以保护封装可靠性。
- 由于封装热阻较大，在持续 100 mA 工作时应保证良好的 PCB 散热（加大铜箔面积或使用热沉铺铜）。
六、可靠性与使用注意事项
- 在高温环境下应对额定电流进行降额（derating），以延长器件寿命并避免过热。
- 峰值浪涌电流 Ifsm 为 300 mA，仅允许短时冲击，避免重复超限使用。
- 对于对称性和开关速度有严格要求的电路，建议在实装后做实际波形测试，验证反向恢复及寄生效应对系统的影响。
七、订购信息与技术支持
- 型号：LDAN202KLT1G
- 品牌：LRC（乐山无线电）
- 封装：SOT-23，常见带卷带包装，适合贴片生产线使用。
- 采购与技术资料请联系 LRC 官方或授权分销商，获取完整数据手册、封装图和可靠性测试报告，以便在设计和生产中准确引用器件规范。
如需基于具体电路的仿真参数、PCB 布局建议或替代型号比较，可提供电路示意与工况，我可进一步协助评估与选型。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
