WMSIC Electronic Components

LRC LNTK2575LT1G

ModelLNTK2575LT1G
PackageSOT-23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LNTK2575LT1G
Type
LRC
Minimum package
3000

Technical parameters

Electronic Component
LRC
Electronic Component
LNTK2575LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0264745494
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
280mW
Electronic Component
3000
Voltage(Vdss)
25V
Capacitor(Ciss)
60pF
Resistor(RDS(on))
249mΩ@4.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LNTK2575LT1G 产品概述

LNTK2575LT1G 是乐山无线电(LRC)推出的一款 N 沟增强型绝缘栅场效应管(MOSFET),采用小型 SOT-23 表面贴装封装,针对低电压、低功耗开关与电平转换应用优化设计。器件在 25V 漏源耐压下可提供最高 700mA 连续漏极电流,适用于便携式电源管理与信号切换场景。

一、主要参数概览

  • 类型:N 沟增强型 MOSFET,封装:SOT-23
  • 漏源电压 Vdss:25V
  • 连续漏极电流 Id:700mA(环境与散热受限条件下)
  • 导通电阻 RDS(on):249mΩ @ Vgs=4.5V
  • 栅阈电压 Vgs(th):1.5V(典型)
  • 总栅极电荷 Qg:1.5nC @ Vgs=4.5V
  • 输入电容 Ciss:60pF,反向传输电容 Crss:12pF
  • 耗散功率 Pd:280mW(需结合 PCB 散热评估)
  • 工作温度范围:-55℃ ~ +150℃

二、产品特点与优势

  • 低电压等级(25V)适合常见的 3.3V/5V 系统应用,栅极阈值低、有利于逻辑电平驱动。
  • 中等 RDS(on) 与较低栅极电荷(1.5nC)兼顾开关损耗与驱动能耗,适合频率不高的开关场合。
  • 小封装 SOT-23 节省 PCB 面积,适用于体积受限的便携设备。
  • 宽工作温度覆盖工业级要求,可靠性良好。

三、典型应用场景

  • 低压电源开关与负载断开(如便携设备电源管理)
  • 电平转换器与信号开关(I/O 保护、模拟开关)
  • 小功率马达或继电器驱动的前端开关
  • 电池保护与充放电路径控制

四、驱动与布局注意事项

  • 推荐使用接近系统电平的栅极驱动(如 4.5V)以达到标称 RDS(on)。若仅由 3.3V 驱动,应验证导通电阻与散热是否满足要求。
  • 低 Qg 有利于 MCU 直接驱动,但仍建议在驱动线加入阻尼电阻以抑制电磁干扰和振铃。
  • PCB 布局应保证漏极-源极回流路径的短而粗,增大铜箔面积以改善散热;SOT-23 的热阻较高,器件功耗受限于 PCB 散热能力。

五、热与可靠性提示

  • 标称耗散功率 280mW 为参考值,实际可用功率受 PCB、环境温度与封装散热影响较大。高于该功率时需保护或选择更大封装器件。
  • 工作温度可到 +150℃,但长期在高温下工作会缩短寿命,建议保证器件结温在安全范围内并预留热裕量。

六、封装与采购信息

  • 封装:SOT-23(表面贴装,适合自动贴装生产)
  • 品牌:LRC(乐山无线电)
  • 型号:LNTK2575LT1G,单只采购或小批量用途适合该型号。

使用该器件时建议在样机阶段验证在目标电压、频率及环境温度下的导通损耗和结温,确保满足系统可靠性与寿命要求。若需更低 RDS(on) 或更高功率能力,可考虑更大封装或低阻型号。

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