Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LITEON LTV-357T-D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- LITEON LTV-357T-D
- Type
- LITEON
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- LITEON
- Electronic Component
- LTV-357T-D
- Electronic Component
- 1
- Package
- 4-SOP
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.203g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM69414749
- Operating Temperature
- 55℃~+110℃
- Load Voltage
- 35V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTV-357T-D 产品概述
一、产品简介
LTV-357T-D是一款由台湾光宝（LITEON）生产的高性能光电耦合器，其设计目的是用于实现信号的电气隔离与传输，广泛应用于工业自动化、通信设备、控制系统及家电等多个领域。此款光电耦合器采用4-SOP封装，具备优异的电气性能、可靠的工作温度范围以及长久的使用寿命。
二、主要特性
通道数与隔离电压：LTV-357T-D为单通道光电耦合器，提供高达3750Vrms的电气隔离能力，确保设备在高电压环境下的安全运行。这一特性使其特别适用于保护低电压电路不受高电压干扰。
电流传输比：该光电耦合器在5mA的输入条件下，能够达到300%（最小值）至600%（最大值）的电流传输比，表明其在信号传输过程中能够有效地增强输入信号，确保输出状态的稳定性。
响应时间：LTV-357T-D的典型上升时间为4µs，下降时间为3µs，显示出其在高速信号传输中的优秀性能。这使得其在数据传输以及脉冲信号处理的应用中，表现出色。
输出特性：此款产品的输出类型为晶体管输出，最大输出电流为50mA，最大输出电压为35V，能够满足大部分应用场景的需要。
正向电压和饱和压降：该光电耦合器的典型正向电压为1.2V，最大直流正向电流为50mA，同时，Vce饱和压降最大为200mV。这些参数确保了在正常工作条件下，LTV-357T-D能够以较低的功耗运行，提高了整个系统的能效。
工作温度：LTV-357T-D的工作温度范围为-55°C到110°C，适用于各种苛刻的环境条件，能够保证其长期稳定工作。
三、应用领域
LTV-357T-D因其卓越的性能和可靠性，广泛应用于以下领域：
- 工业自动化设备：在PLC（可编程逻辑控制器）和传感器之间传输信号，实现电气隔离，保护控制电路。
- 通信设备：在电话交换机、数据通信设备中，用于信号隔离与传输，确保通信的稳定性与可靠性。
- 家用电器：在各类家用电器中进行电流测量与控制，确保能有效地隔离用户与高电压部件。
- 医疗设备：在医疗电子产品中用于信号隔离和传输，确保患者的安全。
四、总结
LTV-357T-D作为一款高性能的光电耦合器，凭借其独特的电气性能、优异的温度适应性及多样的应用场景，成为众多技术人员和工程师选择的关键元器件。无论是在进行复杂工业自动化控制，还是在关键的通信与医疗应用中，LTV-357T-D都能提供稳定、可靠的性能，确保系统的安全和有效运行。借助台湾光宝的卓越技术，LTV-357T-D将极大地促进现代电子设备的发展与普及。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
