Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LITEON MOC3063S-TA1 MOC3063S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- LITEON MOC3063S-TA1
- Type
- LITEON
- Unit
- Electronic Component
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- LITEON
- Electronic Component
- MOC3063S-TA1
- Electronic Component
- 1
- Package
- 6-SMD
- Electronic Component
- Thyristor Output Optocoupler
- Electronic Component
- 0.757g
- Terminal Block
- 6
- Electronic Component
- 1
- Channel Count
- 1
- Staticdv / dt
- 1000V/us
- Features
- Electronic Component
- Electronic Component
- BM0000000633
- Operating Temperature
- 40℃~+100℃
- Current
- 20mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MOC3063S-TA1 产品概述
MOC3063S-TA1 是由台湾光宝（LITEON）推出的一款高性能可控硅输出光耦，广泛应用于电力控制和信号隔离领域。此产品在电子行业中以其卓越的性能和稳定的品质而著称，尤其适合要求高电压隔离的应用场合。
产品特性
输出类型： MOC3063S-TA1 采用双向可控硅（Triac）输出方式，能够有效控制交流负载的开关，从而在电力控制中发挥重要作用。这一特性使其成为家电控制、照明调光以及工业自动化系统中的理想选择。
过零电路： 本产品内置过零电路，在信号交变时能有效减少电压尖峰，减轻开关对电网或负载造成的冲击，延长负载的使用寿命。
电压和电流性能： MOC3063S-TA1 具备高达 600V 的断态电压，能适应各种高电压应用。其静态 dV/dt（最小值）为 1kV/µs，确保在快速变化的电压下也能保持良好的性能。产品的 LED 触发电流（Ift）最大值为 5mA，允许低功耗驱动，同时在较低的触发电流下仍能保持良好的开关性能。
温度范围： MOC3063S-TA1 的工作温度范围广泛，从 -40°C 到 100°C，适合多种环境下的应用，能够在严苛环境中保持稳定工作。
封装和安装类型： 该产品采用表面贴装型（SMD）封装，封装形式为 6-SMD 鸥翼型设计，方便自动化贴装工艺，进一步提升生产效率。
安全与认证： MOC3063S-TA1 通过了 CSA、FIMKO 和 UL 等多个国际认证，确保其在电气安全及可靠性方面达到国际标准，为用户提供了安心的使用保障。
应用场景
MOC3063S-TA1 广泛应用于：
- 家用电器：可用于洗衣机、空调、微波炉等产品的控制，能够有效控制电源开关。
- 照明控制：在灯光调节中，能够实现平滑调光，并降低频闪现象。
- 工业自动化：在PLC控制系统中作为输出接口，帮助实现交流设备的开关控制。
- 电源管理：在电源模块及电源转换器中用于电压隔离，保护下游电路。
总结
MOC3063S-TA1 是一款性能卓越、稳定性强的可控硅输出光耦，凭借其高电压隔离能力、宽温工作范围和高效率的电流控制能力，成为电力控制领域的重要组件。无论是在家电、照明还是工业控制领域，其可靠性和性能都能满足多种复杂的应用需求，帮助设计师提高产品的可靠性和安全性。选用 MOC3063S-TA1，将确保您的电气系统在各种应用环境中保持高效、稳定的操作，是您理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
