WMSIC Electronic Components

LITEON LTV-5341-TP1

ModelLTV-5341-TP1
PackageSOP-5-300mil
BrandLITEON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LITEON LTV-5341-TP1
Type
LITEON
Minimum package
3000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LITEON
Electronic Component
LTV-5341-TP1
Electronic Component
1
Package
SOP-5-300mil
Electronic Component
Logic Output Optocoupler
Electronic Component
0.24g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
30kV/us
Features
Electronic Component
Electronic Component
BM0265750614
Operating Temperature
40℃~+110℃
Operating Voltage
15V~30V
Type
DC
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LTV-5341-TP1 贴片光耦(LITEON)产品概述

一、产品简介

LTV-5341-TP1 是台湾光宝(LITEON)推出的一款SOP-5(300mil)封装贴片光耦,采用输入LED与输出光敏器件隔离传输信号的结构设计。器件提供高达6kVrms 的电气隔离能力,并在工业环境下提供稳健的抗干扰性能,适用于需要信号隔离与共模抑制的场合。

二、主要特性

  • 隔离电压(耐压):6 kVrms,满足多数工业控制与隔离通信的安全要求。
  • 共模瞬态抗扰度(CMTI):30 kV/μs,适应高速干扰环境下的信号完整性要求。
  • 传播延迟:tpLH ≈ 150 ns、tpHL ≈ 150 ns,适用于中等速率的数字/控制信号隔离。
  • 输入类型:DC 驱动(LED),输入阈值电流(FH)约 2.5 mA,易被逻辑电平直接驱动。
  • 输出能力:最高输出电流 3 A(具体连续/脉冲能力请参考数据表),可用于驱动较大负载或作为后级开关。
  • 正向压降(LED):Vf ≈ 1.6 V(典型),便于计算限流电阻。
  • 工作电压范围:15 V ~ 30 V(参考应用侧供电或额定电压范围)。
  • 工作温度范围:-40 ℃ ~ +110 ℃,适合多种工业环境。
  • 功耗:额定耗散功率 Pd ≈ 450 mW(器件热管理需注意)。

三、电气与环境参数(要点)

器件在设计时应考虑输入LED的驱动电流(建议至少达到或略高于 2.5 mA 以保证可靠触发),输出端的电流能力与功耗限制(450 mW)需要合理散热与布局。传播延迟对时序敏感的应用需考虑 150 ns 级别的延迟与抖动。高共模抑制能力使其在电机驱动、变频器等高干扰场景表现优异。

四、典型应用

  • 工业控制与PLC的信号隔离
  • 电源管理与开关电源的驱动隔离
  • 电机驱动与继电器/固态继电器驱动前端隔离
  • 医疗及测试设备的低速/中速数字隔离接口
  • 嵌入式系统与通信接口的逻辑电平隔离

五、设计与使用建议

  • 输入侧:根据驱动电压计算限流电阻 R = (Vdrive − Vf) / If,优先保证 LED 电流达到或超过 2.5 mA。
  • 输出侧:若需长时间大电流驱动,务必查阅完整数据手册确认连续与脉冲额定,并考虑外部散热或并联处理。
  • 布局:保持足够的爬电和气隙距离,尤其在高压端和低压端之间,遵循相关安全规范。
  • EMC 与抑制:在高干扰环境中,可在输入/输出端添加RC或TVS等抑制元件以提高系统稳定性。
  • 温度管理:在高温或高功耗场景下对功耗进行热沉设计或降额使用,确保器件在额定Pd范围内工作。

六、封装与可靠性注意事项

SOP-5-300mil 封装适合自动贴片与波峰/回流焊工艺,焊接后建议做回流曲线与可靠性验证。长期可靠性与安全认证依赖于正确的焊接、PCB 间距及系统级隔离设计,请在最终产品设计中参考 LITEON 的完整数据手册与应用说明。

如需更详细的电气特性曲线、绝对最大额定值及时序图,建议下载并参照 LTV-5341-TP1 官方数据手册以完成最终设计验证。

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