WMSIC Electronic Components

LITEON LTE-C216-P-W

ModelLTE-C216-P-W
Package1206
BrandLITEON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LITEON LTE-C216-P-W
Type
LITEON
Minimum package
3000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LITEON
Electronic Component
LTE-C216-P-W
Electronic Component
1
Package
1206
Electronic Component
850nm
Electronic Component
Infrared Emitter
Electronic Component
100°
Electronic Component
0.037g
Electronic Component
50nm
Electronic Component
1
Electronic Component
BM0264215232
Operating Temperature
40℃~+85℃
Current
60mA
Electronic Component
2.2mW/sr
(Vf)
1.4V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LTE-C216-P-W产品概述

一、产品定位与核心特性

LTE-C216-P-W是台湾光宝(LITEON)推出的1206贴片式近红外发光二极管(LED),核心波长为850nm(人眼不可见的近红外窗口),专为近距离感应、光电耦合、短距离红外通信等低功率应用场景设计。产品兼顾小型化封装、宽视角覆盖与工业级可靠性,适配消费电子、工业控制、医疗设备等领域的紧凑化设备需求。

二、关键性能参数解析

结合官方参数,该产品的核心性能可从光学、电学、环境适应性三个维度拆解,明确其应用边界:

1. 光学性能

  • 波长与光谱:中心波长850nm,半波宽50nm——属于近红外“隐蔽波段”(人眼无感知),适合需要隐私性的感应场景;半波宽适中,既保证信号强度,又避免过宽光谱带来的干扰。
  • 辐射强度:2.2mW/sr(球面度)——在100°视角范围内,辐射功率密度稳定,可支持1~5米内的近距离感应(具体距离取决于接收端灵敏度)。
  • 视角:100°宽视角——发射光覆盖范围广,无需精准对准即可实现有效感应,降低安装调试难度(适合小型设备的非定向感应需求)。

2. 电学性能

  • 正向压降(Vf):1.4V——硅基LED的典型正向压降,驱动电压低,可直接由3.3V/5V电源通过限流电阻驱动,简化电路设计(无需升压/降压电路)。
  • 正向电流(If):额定连续电流60mA——需严格控制连续工作电流不超过该值(否则加速光衰);脉冲应用时可适当提升(需控制占空比≤50%)。
  • 耗散功率(Pd):100mW——最大允许功耗,需确保驱动电路的功率设计符合限制(避免过热导致封装变形或芯片损坏)。
  • 反向耐压(Vr):5V——反向电压不能超过5V,否则会导致反向击穿,使用时需注意极性防护(如串联二极管反向截止)。

3. 环境适应性

  • 工作温度:-40℃~+85℃——覆盖工业级温度范围,可在低温户外(如智能门锁)或高温密闭设备(如机顶盒内部)稳定工作。
  • 储存温度:-55℃~+150℃(光宝封装标准)——满足运输与长期储存的环境要求(无结露、无强光直射)。

三、封装与可靠性设计

LTE-C216-P-W采用1206贴片封装(尺寸约2.0mm×1.6mm×0.8mm),属于小型化表面贴装器件,具有以下优势:

  1. 小型化适配:适合智能手机、智能穿戴、小型光电开关等紧凑设备的PCB布局,节省空间(比传统直插LED体积小60%以上)。
  2. 工艺可靠性:光宝采用成熟的环氧树脂封装工艺,抗冲击、抗振动性能优异,可通过回流焊、波峰焊等常规贴片工艺加工(焊接参数:回流焊峰值温度≤260℃,时间≤10秒;波峰焊温度≤240℃,时间≤3秒)。
  3. 光衰控制:低功耗设计结合优质GaAs芯片,长期工作时光衰速率低(光宝典型光衰≤10%/1000小时),保证产品寿命(设计寿命≥5万小时)。

四、典型应用场景

该产品因低功耗、宽视角、隐蔽性等特点,广泛应用于以下场景:

  1. 近距离红外感应:智能手机/平板的距离传感器(Proximity Sensor),实现通话时屏幕自动熄灭、口袋模式防误触。
  2. 光电开关与传感器:工业自动化中的小型光电开关、流水线计数传感器,用于检测物体有无、位置识别(如电子秤物品检测)。
  3. 短距离红外通信:低成本遥控器(如机顶盒、玩具)、智能家居设备的红外数据传输(替代蓝牙低功耗的低成本方案)。
  4. 医疗设备辅助:便携式血糖检测仪、血氧仪的红外检测模块(需结合850nm/940nm双波长,该产品可作为其中一路)。

五、选型与使用注意事项

为保证产品性能与寿命,需注意以下要点:

  1. 驱动电路设计:串联限流电阻计算公式为( R = (V_{电源} - Vf) / If )(如电源3.3V,限流电阻≈33Ω;5V电源则≈60Ω),避免过流。
  2. 极性防护:明确LED正负极(通常长脚为正,或PCB板标注“+”),反向接电会导致瞬间击穿。
  3. 环境限制:避免在强光直射(如阳光、强红外光源)下工作(干扰感应信号);储存时湿度≤60%RH,远离潮湿环境。
  4. 焊接质量:回流焊后需检查引脚焊接完整性(无虚焊、无桥接),波峰焊时需保护透镜不受高温损伤。

综上,LTE-C216-P-W是一款高性价比的小型化近红外LED,适合对体积、功耗、可靠性有要求的近距离感应与通信场景,是消费电子与工业设备的常用选型之一。

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