WMSIC Electronic Components

LITEON LTV-815S-TA1

ModelLTV-815S-TA1
PackageSMD-4P
BrandLITEON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
LITEON LTV-815S-TA1
Type
LITEON
Unit
Electronic Component
Minimum package
1000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
LITEON
Electronic Component
LTV-815S-TA1
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.273g
Electronic Component
1
Electronic Component
53us@10mA,100Ω
Electronic Component
BM0230871982
Operating Temperature
30℃~+110℃
Load Voltage
35V
Type
DC
Output Current
80mA
Output Type
Photoelectric Transistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LTV-815S-TA1 产品概述

一、产品简介

LTV-815S-TA1 是 LITEON(台湾光宝)出品的一款小封装达林顿晶体管输出光耦合器,采用 SMD-4P 表面贴装封装设计。器件以发光二极管(LED)为输入,达林顿光电晶体管为输出,适用于需要高电流传输比(CTR)和较大输出电流的隔离信号传输场合。器件标称隔离电压 Vrms=5kV,工作温度范围宽,适合工业类电子设备使用。

二、主要性能参数

  • 隔离电压(Vrms):5 kV
  • 输入类型:DC,正向压降 Vf ≈ 1.2 V(If 可达 50 mA)
  • 直流反向耐压 Vr:6 V
  • 电流传输比(CTR):最小 600%,典型/饱和值可达 7,500%(制造公差较大,应按实测或最小值设计)
  • 输出类型:光电达林顿晶体管,最大输出电流 Ic ≈ 80 mA,负载电压最高 35 V
  • 集—射极饱和电压 VCE(sat):约 0.8 V(典型测试条件见规格)
  • 上升/下降时间:tr = 60 μs,tf = 53 μs(测试条件 10 mA, 100 Ω)
  • 总功耗 Pd:200 mW
  • 工作温度:-30 ℃ ~ +110 ℃
  • 封装:SMD-4P

三、应用场景

  • 微控制器到高压或噪声环境的数字信号隔离(低频或开关信号)
  • 工业控制接口、继电器驱动预级隔离(作为信号隔离而非高频传输)
  • 开关电源的反馈隔离(需注意带宽与响应时间)
  • 各类电源模块、家电与仪表中的安全隔离与逻辑电平隔离

四、电路与驱动建议

  • 驱动 LED 时应按最小 CTR 和目标输出电流计算 LED 驱动电流:例如在 5 V 逻辑下,若目标 If = 5 mA,则限流电阻 R = (Vcc − Vf) / If ≈ (5 − 1.2) / 5 mA ≈ 760 Ω,常用 820 Ω。
  • 由于 CTR 有较大变化量,驱动高输出电流(接近 80 mA)时,应留有裕量并参考最低 CTR 值进行设计;若需精确输出,建议在电路中加入负反馈或使用恒流驱动。
  • 注意 VCE(sat) 约 0.8 V,作为开关或饱和导通时应考虑功率耗散与压降。输出端最高允许负载电压为 35 V。
  • 响应速度有限(上/下降时间为几十微秒),不适合高频信号或精密模拟传输,适合工频或低速数字隔离。

五、封装与可靠性

  • SMD-4P 表面贴装,适合自动化贴片生产与高密度电路板。
  • 隔离电压 5 kV 满足较高绝缘要求,但在设计时仍需注意爬电距离、爬电材料与外壳防护以保证长期可靠性。
  • 工作温度范围宽(-30 ℃ ~ +110 ℃),适合工业环境,但在高温或高湿条件下应注意 CTR 与寿命衰减。

六、注意事项与选型建议

  • CTR 波动大:在关键应用中请以最小 CTR(600%)或实测值作为设计依据。若电路对传输比依赖严格,建议选择带反馈或线性隔离方案。
  • 功耗与发热:总功耗 Pd=200 mW,长时间高 If 或高 Ic 条件下注意热设计与散热。
  • 响应时间限制了高速应用:上/下降时间在几十微秒级,若需更快响应应考虑高速光耦或数字隔离器。
  • 若需更高隔离能力或更稳定 CTR,可咨询厂商样片测试或参考完整数据手册。

总体而言,LTV-815S-TA1 以高 CTR 与较大输出电流为特点,适用于对隔离电流放大有需求的低频工业与控制类应用。设计时建议优先按最小 CTR 和器件的热限、响应特性进行稳健设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.