WMSIC Electronic Components

LITEON LTV-227-C

ModelLTV-227-C
PackageSOP-8
BrandLITEON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
LITEON LTV-227-C
Type
LITEON
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LITEON
Electronic Component
LTV-227-C
Electronic Component
1
Package
SOP-8
Electronic Component
Transistor Output Optocoupler
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0264782250
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LTV-227-C 产品概述

一、产品简介

LTV-227-C 是由台湾光宝科技(LITEON)生产的高性能光隔离器,采用 SOP-8 封装。该器件集成了光电传输技术,广泛应用于工业控制、通信设备、电源管理及消费电子等领域,以实现信号的电气隔离和传输。LTV-227-C 的设计使其在提供高可靠性的信号传输的同时,也确保了在高电压环境下的安全性。

二、主要特点

  1. 高隔离电压: LTV-227-C 能够提供较高的电气隔离,使其成为电气噪声抑制和信号隔离的理想选择。其额定隔离电压达到 5kVrms,有效防止高电压对下游电路造成影响。

  2. 高传输速率: 本器件具有较高的数据传输速率(通常可达 1 Mbps),适合高速信号传输的需求。这使得 LTV-227-C 在需要频繁信号交互的应用中表现出色。

  3. 低功耗: LTV-227-C 的工作功耗较低,能够有效延长电池驱动设备的使用时间,适用于便携式和低功耗的系统设计。

  4. 宽工作温度范围: 该光隔离器可在广泛的温度范围内正常工作,通常为 -40°C 至 +85°C。这一特性使得 LTV-227-C 能够适应各种工业和极端环境下的应用需求。

  5. 简易接口: LTV-227-C 的 SOP-8 封装设计使其在 PCB 布局时更为简便,且与其他组装元件的兼容性较好,方便用户进行集成。

三、应用领域

LTV-227-C 适用的应用场景广泛,包含但不限于:

  • 工业自动化:在各种控制系统中用作信号隔离,保护传感器和控制器,提高系统稳定性与安全性。

  • 电源管理:在开关电源及其他功率转换器中进行信号的反馈和控制,确保不受电网波动影响。

  • 通信设备:用于数据通信的隔离,提升信号质量,并降低噪声干扰,确保数据传输的准确性。

  • 医疗设备:在医疗仪器中可用作隔离保护电路,确保患者与设备之间的安全隔离。

  • 消费电子:在家用电器及其他电子产品中,提供信号隔离,保护电路避免由于电气故障而导致的损坏。

四、规格及参数

LTV-227-C 的典型规格参数包括:

  • 材料:高可靠性的半导体材料
  • 隔离电压:5kVrms
  • 数据传输速率:≥1 Mbps
  • 工作温度范围:-40°C 至 +85°C
  • 封装类型:SOP-8
  • 操作电压:通常为 5V(可根据具体应用需求调节)

五、总结

LTV-227-C 光隔离器凭借其高隔离电压、高传输速率、低功耗等优点,已成为众多工业和消费电子产品中不可或缺的重要元件。其广泛的应用领域以及良好的性能使其在各种设计需求中均能提供可靠的电气隔离与信号传递解决方案。选择 LTV-227-C,您将获得高性能与高可靠性的优质电子元件,有助于提升产品的整体性能和安全性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.