Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LITEON LTV-817M-C
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LITEON LTV-817M-C
- Type
- LITEON
- Minimum package
- 2000 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LITEON
- Electronic Component
- LTV-817M-C
- Electronic Component
- 1
- Package
- DIP-4
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.42g
- Electronic Component
- 1
- Electronic Component
- 3us@2mA,100Ω
- Electronic Component
- BM0000002566
- Operating Temperature
- 30℃~+110℃
- Load Voltage
- 35V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- Output Channel Count
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTV-817M-C 产品概述
一、产品简介
LTV-817M-C是由知名品牌LITEON（台湾光宝）制造的一款光电耦合器，采用DIP-4封装，广泛应用于各种电子设备中，特别是在需要电气隔离和信号传输的场景中。其主要特性包括一个光电三极管输出，能够承受最高50mA的输出电流，以及较低的导通电压1.2V，使其在各种工业和消费类应用中表现优异。
二、产品特性
光电隔离: LTV-817M-C具有良好的电气隔离能力，能够有效防止高电压和噪声对低电压电路的影响。这对于保护微处理器及其他精密设备免受过载和短路的影响至关重要。
工作电流与电压: 该光电耦合器的输出电流可达到50mA，而导通电压仅为1.2V。较低的导通电压使其在功耗方面具有优势，可以在更低的电压条件下实现可靠的信号传输，适用于低功耗应用。
封装类型: DIP-4封装使得LTV-817M-C易于插装并适合于各种电路板，便于生产和维护。DIP封装的设计也确保了良好的插入和焊接性能。
热性能: LTV-817M-C在工作时具有较好的热稳定性，能够在一定范围的温度下稳定工作，通常的工作温度范围是-40°C至+85°C，适合多种环境条件下的应用。
输出特性: 输出光电三极管具有高的传输速率，适合用于高速信号传输，不仅限于数字信号，也可以用于模拟信号的耦合。
三、应用领域
LTV-817M-C因其出色的特性在多个领域中找到了广泛的应用，包括但不限于：
工业自动化: 在PLC（可编程逻辑控制器）、传感器接口及其他控制系统中，LTV-817M-C可用于实现数据信号的隔离和传输，确保系统的可靠性和稳定性。
消费电子: 该光电耦合器可用于电视、音响、个人电脑等消费电子产品中，实现信号的隔离和噪声抑制，提升产品的整体性能。
医疗设备: 在医疗电子器件中，LTV-817M-C可用于确保病人安全，防止高电压电流对敏感部件的损害，提供安全的信号传输。
通信设备: 其较快的传输速率和良好的信号完整性使其适合在各种通信设备中使用，用于实现信号的隔离和处理。
四、总结
LTV-817M-C作为LITEON的一款精密电子元件，通过其优良的光电隔离性能和高效的信号传输能力，适用于众多工业和消费场景，为各种电路设计提供了便利与可靠性。得益于其DIP-4封装及出色的电性能，设计工程师在选择光电耦合器时，将LTV-817M-C视为一个理想的解决方案。随着电子技术的不断进步和需求的多样化，LTV-817M-C将继续在各大应用领域发挥其重要作用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
