WMSIC Electronic Components

LITEON MOC3063M-A MOC3063M

ModelMOC3063M-A
PackageDIP-6
BrandLITEON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LITEON MOC3063M-A
Type
LITEON
Minimum package
1040 卷

Technical parameters

Electronic Component
LITEON
Electronic Component
MOC3063M-A
Electronic Component
1
Package
DIP-6
Electronic Component
Thyristor Output Optocoupler
Electronic Component
0.719g
Terminal Block
6
Electronic Component
1
Channel Count
1
Staticdv / dt
1000V/us
Features
Electronic Component
Electronic Component
BM0228061280
Operating Temperature
25℃~+85℃
Current
10mA
Surge Current
1A
(Vf)
1.2V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MOC3063M-A 产品概述

一、简介

MOC3063M-A 是来自 LITEON(台湾光宝)的一款直插式光电隔离器,适用于交流负载的开关与驱动控制。该器件由输入发光二极管与输出光触发器件组成,通过光耦实现输入与输出的电气隔离,从而提高系统安全性与抗干扰能力。外形为 DIP 插装封装,便于在通用电路板上直接插装与替换。

二、主要参数

  • 正向电流(IF):10 mA(典型驱动电流)
  • 正向压降(Vf):1.2 V(LED 正向压降)
  • 输出有效电流(It(rms)):100 mA
  • 浪涌电流:1 A(短时峰值)
  • 静态 dv/dt 抗扰度:1000 V/μs
  • 隔离电压(Vrms):5 kV(绝缘耐压)
  • 耗散功率(Pd):330 mW
  • 工作温度范围:-25 ℃ ~ +85 ℃
  • 通道数:1
  • 端子数:6;封装:DIP-5(直插式)
  • 描述:直插光耦 MOC3063M-A;品牌:LITEON(台湾光宝)

三、特性与优势

  • 高隔离耐压:5 kVrms 隔离等级适合工业控制及需高电压隔离的应用场合。
  • 优良的 dv/dt 抗扰度(1000 V/μs):在开关噪声和共模瞬态干扰较高的环境中仍能可靠触发,降低误触发风险。
  • 低驱动电流:典型 LED 驱动电流仅 10 mA,有利于降低驱动端功耗与外部驱动器负担。
  • 封装便捷:DIP 插装便于手工与自动化装配,适合样机开发及小批量生产。

四、典型应用

  • TRIAC / SCR 门极驱动与隔离控制(交流调光、电机调速、加热器控制)
  • 家用电器与工业电源的交流开关隔离
  • 需要高电压隔离的测控与保护电路
  • 安全隔离接口与噪声敏感系统中的信号隔离

五、设计与使用建议

  • 驱动侧:根据 LED 正向压降 Vf(约 1.2 V)与所需 IF(最大 10 mA),计算串联限流电阻以保证稳定驱动和避免过流。
  • 输出侧:尽管输出 It(rms) 可达 100 mA,实际驱动外部可控硅/三端双向可控硅时,应参考被驱动器件门极要求并留有裕量;必要时并联缓冲器以承受启动浪涌(1 A)。
  • 抗干扰与吸收:在高 dv/dt 或含有电气噪声的环境,建议在输出端配合 RC 阻容吸收网络(snubber)或适当的门极电阻,以防误触发并控制 dv/dt 影响。
  • 热管理与功耗:器件耗散功率 Pd 为 330 mW,长期可靠工作请注意功耗分布与避免温升过高,必要时在电路板布局时留出散热空间并考虑降额设计。
  • 安全与布局:保持输入、输出区的爬电距离与绝缘材料要求以满足 5 kVrms 隔离规范,布线时注意最短绝缘路径与防潮保护。

六、封装与可靠性

MOC3063M-A 提供直插 DIP-5 形式,便于插装与测试;器件额定工作温度 -25 ℃ 至 +85 ℃,适用于多数室温及工业环境。出于长期可靠性考虑,建议在高温或高湿环境下进行老化与应力测试,以确认电气参数随时间的稳定性。

总结:MOC3063M-A 以其高隔离电压、良好的 dv/dt 抗扰能力和低驱动电流,适合用于交流侧开关控制与可控硅/三端双向可控硅门极隔离驱动场合。在具体应用中应综合考虑驱动条件、热耗与抗干扰措施,以实现稳定可靠的系统性能。

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